EP3SL200F1152I4NAE
EP3SL200F1152I4NAE
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Intel Corporation

EP3SL200F1152I4NAE


EP3SL200F1152I4NAE
F18-EP3SL200F1152I4NAE
Active
IC FPGA 744 I/O 1152FBGA
1152-FBGA (35x35)

EP3SL200F1152I4NAE ECAD Model


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EP3SL200F1152I4NAE Attributes


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EP3SL200F1152I4NAE Overview



The chip model EP3SL200F1152I4NAE is an advanced system-on-chip (SoC) designed by Altera Corporation, a leading provider of semiconductor products. The chip is designed to provide a cost-effective and high-performance solution for communication and networking applications. It is a multi-core processor, with two ARM Cortex-A9 and one Cortex-M3 cores. It is also equipped with a range of peripherals such as Ethernet, USB, UART, and CAN.


The original design intention of the EP3SL200F1152I4NAE was to provide a powerful and cost-effective solution for communication and networking applications. It is capable of supporting a wide range of communication protocols, including Ethernet, Wi-Fi, and Bluetooth. Moreover, it is designed to be highly scalable and can be easily upgraded to meet the demands of future applications.


The EP3SL200F1152I4NAE is an ideal solution for advanced communication systems. It is capable of supporting a variety of network topologies and protocols, and can be used for applications such as high-speed data transfer, voice over IP, and wireless networking. Furthermore, it is well suited for intelligent scenarios such as machine learning, artificial intelligence, and autonomous driving.


In terms of product description and design requirements, the EP3SL200F1152I4NAE is a high-performance SoC with a wide range of features and capabilities. It is designed to be highly reliable and efficient, and is capable of supporting a wide range of communication protocols. It also has an integrated memory controller and a range of peripherals.


The EP3SL200F1152I4NAE has been used in a variety of applications, such as industrial control systems, medical devices, and consumer electronics. It has also been used in a number of case studies to demonstrate its capabilities. For example, it has been used in a project to develop a low-cost, low-power wireless sensor network.


When using the EP3SL200F1152I4NAE, it is important to consider the power requirements and the specific design constraints of the application. It is also important to ensure that the chip is properly configured and that the necessary drivers and software are installed. Furthermore, it is important to ensure that the chip is not over-clocked or otherwise over-stressed.


In conclusion, the EP3SL200F1152I4NAE is an advanced SoC designed for communication and networking applications. It is highly scalable and can be easily upgraded to meet the demands of future applications. It is capable of supporting a wide range of communication protocols and is well suited for intelligent scenarios such as machine learning, artificial intelligence, and autonomous driving. It has been used in a variety of applications and case studies, and it is important to consider the power requirements and design constraints when using the chip.



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