EP3SL200F1152I4LN
EP3SL200F1152I4LN
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Intel Corporation

EP3SL200F1152I4LN


EP3SL200F1152I4LN
F18-EP3SL200F1152I4LN
Active
IC FPGA 744 I/O 1152FBGA
1152-FBGA (35x35)

EP3SL200F1152I4LN ECAD Model


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EP3SL200F1152I4LN Attributes


Type Description Select
Mfr Intel
Series Stratix® III L
Package Tray
Number of LABs/CLBs 8000
Number of Logic Elements/Cells 200000
Total RAM Bits 10901504
Number of I/O 744
Voltage - Supply 0.86V ~ 1.15V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1152-BBGA, FCBGA
Supplier Device Package 1152-FBGA (35x35)
Base Product Number EP3SL200

EP3SL200F1152I4LN Datasheet Download


EP3SL200F1152I4LN Overview



The EP3SL200F1152I4LN is a low-power, high-performance, low-cost FPGA chip model manufactured by Altera. It is based on the Stratix III architecture, which provides a flexible and efficient design platform. The chip contains 11,520 logic elements, 1,152 embedded RAM blocks, and 4,096 flip-flops. It also has a maximum operating frequency of 400MHz and a maximum power consumption of 4.5W.


The chip is ideal for applications that require high performance, low power consumption, and low cost. It can be used in a variety of applications such as digital signal processing, image processing, embedded systems, and networking. It can also be used for applications that require high speed and low latency, such as high-speed data transfer and communication.


The chip is designed to be easy to use and configure. It has a wide variety of tools and features that allow for easy customization and implementation. It also has a wide range of I/O and clock options, allowing for flexible and efficient design.


Overall, the EP3SL200F1152I4LN is a powerful and efficient FPGA chip model that is suitable for a variety of applications. It is a cost-effective solution that provides high performance, low power consumption, and easy customization.



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