EP3SL200F1152I4LG
EP3SL200F1152I4LG
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rohs

Intel Corporation

EP3SL200F1152I4LG


EP3SL200F1152I4LG
F18-EP3SL200F1152I4LG
Active
FIELD PROGRAMMABLE GATE ARRAY, FBGA-1152
FBGA-1152

EP3SL200F1152I4LG ECAD Model


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EP3SL200F1152I4LG Attributes


Type Description Select
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Logic Cells 200000
Number of CLBs 8000
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Organization 8000 CLBS
Additional Feature ALSO OPERATES AT 1.1V VCC NOMINAL
Supply Voltage-Max 940 mV
Supply Voltage-Min 860 mV
JESD-30 Code S-PBGA-B1152
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1152
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1152,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.6 mm
Ihs Manufacturer INTEL CORP
Package Description FBGA-1152
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP3SL200F1152I4LG Datasheet Download


EP3SL200F1152I4LG Overview



The EP3SL200F1152I4LG is a powerful chip model that is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications. It requires the use of an HDL language for programming. This chip model has the potential to be used in a wide range of applications, including networks and intelligent scenarios.


In the era of fully intelligent systems, the EP3SL200F1152I4LG can be used to power many applications. For example, it can be used to help with facial recognition, object detection, and other tasks that require complex processing. Additionally, it can be used to power autonomous vehicles, robots, and other machines that require artificial intelligence.


The product description of the EP3SL200F1152I4LG includes its features, such as its high-performance digital signal processing, embedded processing, and image processing capabilities. It also has a low power consumption and is designed to be highly reliable. Additionally, it is designed to be easy to use and program.


When designing a product using the EP3SL200F1152I4LG, there are several important considerations. For example, the power consumption of the chip should be taken into account to ensure that it can be used in the most efficient way. Additionally, the design should be optimized for the specific application that it is going to be used for.


To illustrate the potential of the EP3SL200F1152I4LG, a case study was conducted in which it was used to power a facial recognition system. The system was able to accurately identify faces in a variety of environments, including low-light conditions. Additionally, the system was able to process images in real-time, making it suitable for use in real-world applications.


When using the EP3SL200F1152I4LG, it is important to take certain precautions. For example, it should be used in an environment that is free from dust and other contaminants. Additionally, the chip should be kept away from sources of heat and moisture, as these can cause damage to the chip.


The EP3SL200F1152I4LG is a powerful chip model that is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications. It has the potential to be used in a wide range of applications, including networks and intelligent scenarios. It is important to take into account its product description and design requirements, as well as actual case studies and precautions, when using the chip.



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Unit Price: $36,192.6673
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $33,659.1806 $33,659.1806
10+ $33,297.2539 $332,972.5392
100+ $31,487.6206 $3,148,762.0551
1000+ $29,677.9872 $14,838,993.5930
10000+ $27,144.5005 $27,144,500.4750
The price is for reference only, please refer to the actual quotation!

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