Intel Corporation
EP3SL200F1152I4G
EP3SL200F1152I4G ECAD Model
EP3SL200F1152I4G Attributes
| Type | Description | Select |
|---|---|---|
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 744 | |
| Number of Outputs | 744 | |
| Number of Logic Cells | 200000 | |
| Number of CLBs | 8000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Organization | 8000 CLBS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.55 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL200F1152I4G Datasheet Download
EP3SL200F1152I4G Overview
The chip model EP3SL200F1152I4G is a high-performance programmable logic device (PLD) with a wide range of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, etc. It is designed for use with the HDL (Hardware Description Language) language, allowing for the development of complex systems.
The EP3SL200F1152I4G is a powerful and reliable chip model that can be used in many scenarios, including networks, intelligent systems, and more. It is designed to be used in the era of fully intelligent systems, allowing for the development of sophisticated systems with advanced intelligence.
The EP3SL200F1152I4G is a reliable and powerful chip model that can be used in a variety of applications. It is designed to be used with HDL language and is capable of processing digital signals, embedded processing, and image processing. The product description and design requirements are available on the manufacturer's website.
The EP3SL200F1152I4G is a powerful and reliable chip model that can be used in many applications. It is designed to be used with the HDL language and can be used in a variety of scenarios, including networks and intelligent systems. In addition, it is capable of being used in the era of fully intelligent systems.
When using the EP3SL200F1152I4G, there are certain precautions that should be taken. It is important to read the product description and design requirements carefully before using the chip model. In addition, it is important to understand the application and the specific requirements of the system before using the chip model.
The EP3SL200F1152I4G is a powerful and reliable chip model that can be used in many applications. It is designed to be used with the HDL language and can be used in a variety of scenarios, including networks and intelligent systems. With careful consideration of the design requirements and product description, the EP3SL200F1152I4G can be used to develop sophisticated systems with advanced intelligence. Case studies are available on the manufacturer's website, providing insight into the use of the chip model and the potential applications.
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1,121 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $25,879.4363 | $25,879.4363 |
| 10+ | $25,601.1628 | $256,011.6283 |
| 100+ | $24,209.7953 | $2,420,979.5283 |
| 1000+ | $22,818.4277 | $11,409,213.8690 |
| 10000+ | $20,870.5132 | $20,870,513.1750 |
| The price is for reference only, please refer to the actual quotation! | ||