EP3SL200F1152I4
EP3SL200F1152I4
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Intel Corporation

EP3SL200F1152I4


EP3SL200F1152I4
F18-EP3SL200F1152I4
Active
IC FPGA 744 I/O 1152FBGA
1152-FBGA (35x35)

EP3SL200F1152I4 ECAD Model


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EP3SL200F1152I4 Attributes


Type Description Select
Mfr Intel
Series Stratix® III L
Package Tray
Number of LABs/CLBs 8000
Number of Logic Elements/Cells 200000
Total RAM Bits 10901504
Number of I/O 744
Voltage - Supply 0.86V ~ 1.15V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1152-BBGA, FCBGA
Supplier Device Package 1152-FBGA (35x35)
Base Product Number EP3SL200

EP3SL200F1152I4 Datasheet Download


EP3SL200F1152I4 Overview



The EP3SL200F1152I4 is an FPGA chip from Altera, a leading provider of programmable logic solutions. This device is designed for high-performance, low-power applications in a wide variety of industries. It features a low-power core and a high-density logic array, making it suitable for a wide range of applications.


The EP3SL200F1152I4 has a total of 11,520 logic elements, including 10,240 logic elements and 1,280 flip-flops. It also includes 8,192 Kbits of embedded memory, and a wide range of I/O options, including LVTTL, LVCMOS, and differential I/O. It also has an onboard PLL and a large number of configurable logic blocks.


The EP3SL200F1152I4 is designed for use in a variety of applications, including communications, industrial automation, and audio/video processing. It is also suitable for use in applications such as digital signal processing, embedded systems, and medical imaging.


The EP3SL200F1152I4 is designed for low-power operation and is compliant with the JEDEC standard for power consumption. It also features a wide operating temperature range of -40°C to +85°C. It is available in a range of package sizes and pin counts, making it suitable for a wide range of applications.


In summary, the EP3SL200F1152I4 is a high-performance, low-power FPGA chip from Altera. It features a low-power core, high-density logic array, 8,192 Kbits of embedded memory, and a wide range of I/O options. It is suitable for a variety of applications, including communications, industrial automation, and audio/video processing. It is also compliant with the JEDEC standard for power consumption and has a wide operating temperature range.



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