Intel Corporation
EP3SL200F1152I3G
EP3SL200F1152I3G ECAD Model
EP3SL200F1152I3G Attributes
| Type | Description | Select |
|---|---|---|
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 744 | |
| Number of Outputs | 744 | |
| Number of Logic Cells | 200000 | |
| Number of CLBs | 8000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Organization | 8000 CLBS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.55 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL200F1152I3G Datasheet Download
EP3SL200F1152I3G Overview
The chip model EP3SL200F1152I3G is a powerful and versatile tool for various digital signal processing, embedded processing and image processing applications. It is designed to be used with the HDL language, offering a wide range of options for users to create and execute complex tasks.
The chip model EP3SL200F1152I3G has a wide range of features, including a high-performance processor, a high-speed memory, and a wide range of peripherals and interfaces. It also provides a comprehensive set of development tools, including a powerful debugger, a simulator, and a code generator. This makes it easier for users to develop and debug applications.
In addition, the chip model EP3SL200F1152I3G also has a wide range of applications, such as industrial automation, medical imaging, robotics, and other embedded systems. For example, it can be used to develop and popularize future intelligent robots. To use the model effectively, users need to have a good understanding of the HDL language, as well as a good knowledge of the underlying hardware architecture.
When using the chip model EP3SL200F1152I3G, users should also pay attention to some of the product description and design requirements. For example, it is important to ensure that the power supply is stable, and that the power supply voltage and current levels are within the specified range. In addition, users should also pay attention to the temperature and humidity of the environment, as these can affect the performance of the chip model.
The chip model EP3SL200F1152I3G is a powerful and versatile tool for digital signal processing, embedded processing, and image processing applications. It is designed to be used with the HDL language, and provides a wide range of features and applications. To use the model effectively, users need to have a good understanding of the HDL language, as well as a good knowledge of the underlying hardware architecture. Additionally, users should also pay attention to the product description and design requirements, as well as the temperature and humidity of the environment. With the right skills and knowledge, the chip model EP3SL200F1152I3G can be used to develop and popularize future intelligent robots.
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4,333 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $33,640.6415 | $33,640.6415 |
| 10+ | $33,278.9142 | $332,789.1418 |
| 100+ | $31,470.2775 | $3,147,027.7536 |
| 1000+ | $29,661.6409 | $14,830,820.4480 |
| 10000+ | $27,129.5496 | $27,129,549.6000 |
| The price is for reference only, please refer to the actual quotation! | ||