EP3SL200F1152C4LN
EP3SL200F1152C4LN
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rohs

Intel Corporation

EP3SL200F1152C4LN


EP3SL200F1152C4LN
F18-EP3SL200F1152C4LN
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, LEAD FREE, FBGA-1152
LEAD FREE, FBGA-1152

EP3SL200F1152C4LN ECAD Model


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EP3SL200F1152C4LN Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 900 mV
Number of Inputs 744
Number of Outputs 744
Number of Logic Cells 200000
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Additional Feature IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Clock Frequency-Max 717 MHz
Power Supplies 1.2/3.3 V
Supply Voltage-Max 940 mV
Supply Voltage-Min 860 mV
JESD-30 Code S-PBGA-B1152
Qualification Status Not Qualified
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1152
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1152,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.9 mm
Ihs Manufacturer INTEL CORP
Package Description LEAD FREE, FBGA-1152
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP3SL200F1152C4LN Datasheet Download


EP3SL200F1152C4LN Overview



The chip model EP3SL200F1152C4LN is a highly advanced and powerful component designed to be used in modern communication systems. It is an integrated circuit, or IC, which is capable of performing multiple functions and is capable of handling a variety of tasks. The original design intention of the chip model EP3SL200F1152C4LN was to provide a highly efficient and reliable means of communication and data processing. It is capable of handling multiple tasks simultaneously and can be used to develop and popularize future intelligent robots.


The product description of the chip model EP3SL200F1152C4LN states that it is a low power, high-speed processor with a maximum operating frequency of 200MHz. It is designed to be used in a wide variety of communication systems, including wireless, wired, and fiber-optic networks. It is also capable of supporting multiple operating systems, such as Linux, Windows, and Mac OS. The chip model EP3SL200F1152C4LN is also capable of handling multiple tasks simultaneously, allowing for higher performance and efficiency.


The design requirements of the chip model EP3SL200F1152C4LN are quite specific. It must be able to handle multiple tasks simultaneously and be capable of supporting multiple operating systems. It must also be able to handle high-speed data transmission, as well as low-power operation. In addition, the chip model EP3SL200F1152C4LN must be able to handle multiple communication protocols and be capable of supporting various types of communication networks.


In order to use the chip model EP3SL200F1152C4LN effectively, certain technical talents are needed. These include knowledge of various communication protocols and networks, as well as understanding of the various operating systems it is capable of supporting. In addition, knowledge of the various types of communication systems, such as wireless, wired, and fiber-optic networks, is also necessary. Furthermore, knowledge of the various types of communication devices, such as routers, switches, and modems, is also required.


When it comes to the possibility of future upgrades, the chip model EP3SL200F1152C4LN is capable of being upgraded to meet future requirements. It is also capable of being used in advanced communication systems, such as those used in the development and popularization of future intelligent robots. In order to use the chip model EP3SL200F1152C4LN effectively in such systems, certain technical talents are required, such as knowledge of the various communication protocols and networks, as well as understanding of the various operating systems it is capable of supporting.


Overall, the chip model EP3SL200F1152C4LN is a powerful and versatile component that is capable of handling multiple tasks simultaneously. It is designed to be used in a variety of communication systems, including wireless, wired, and fiber-optic networks. It is also capable of being upgraded to meet future requirements and is capable of being used in the development and popularization of future intelligent robots. In order to use the chip model EP3SL200F1152C4LN effectively, certain technical talents are required, such as knowledge of the various communication protocols and networks, as well as understanding of the various operating systems it is capable of supporting.



1,453 In Stock


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Unit Price: $5,394.034
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $5,016.4516 $5,016.4516
10+ $4,962.5113 $49,625.1128
100+ $4,692.8096 $469,280.9580
1000+ $4,423.1079 $2,211,553.9400
10000+ $4,045.5255 $4,045,525.5000
The price is for reference only, please refer to the actual quotation!

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