
Intel Corporation
EP3SL200F1152C4LN
EP3SL200F1152C4LN ECAD Model
EP3SL200F1152C4LN Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 744 | |
Number of Outputs | 744 | |
Number of Logic Cells | 200000 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
Clock Frequency-Max | 717 MHz | |
Power Supplies | 1.2/3.3 V | |
Supply Voltage-Max | 940 mV | |
Supply Voltage-Min | 860 mV | |
JESD-30 Code | S-PBGA-B1152 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.9 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | LEAD FREE, FBGA-1152 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EP3SL200F1152C4LN Datasheet Download
EP3SL200F1152C4LN Overview
The chip model EP3SL200F1152C4LN is a highly advanced and powerful component designed to be used in modern communication systems. It is an integrated circuit, or IC, which is capable of performing multiple functions and is capable of handling a variety of tasks. The original design intention of the chip model EP3SL200F1152C4LN was to provide a highly efficient and reliable means of communication and data processing. It is capable of handling multiple tasks simultaneously and can be used to develop and popularize future intelligent robots.
The product description of the chip model EP3SL200F1152C4LN states that it is a low power, high-speed processor with a maximum operating frequency of 200MHz. It is designed to be used in a wide variety of communication systems, including wireless, wired, and fiber-optic networks. It is also capable of supporting multiple operating systems, such as Linux, Windows, and Mac OS. The chip model EP3SL200F1152C4LN is also capable of handling multiple tasks simultaneously, allowing for higher performance and efficiency.
The design requirements of the chip model EP3SL200F1152C4LN are quite specific. It must be able to handle multiple tasks simultaneously and be capable of supporting multiple operating systems. It must also be able to handle high-speed data transmission, as well as low-power operation. In addition, the chip model EP3SL200F1152C4LN must be able to handle multiple communication protocols and be capable of supporting various types of communication networks.
In order to use the chip model EP3SL200F1152C4LN effectively, certain technical talents are needed. These include knowledge of various communication protocols and networks, as well as understanding of the various operating systems it is capable of supporting. In addition, knowledge of the various types of communication systems, such as wireless, wired, and fiber-optic networks, is also necessary. Furthermore, knowledge of the various types of communication devices, such as routers, switches, and modems, is also required.
When it comes to the possibility of future upgrades, the chip model EP3SL200F1152C4LN is capable of being upgraded to meet future requirements. It is also capable of being used in advanced communication systems, such as those used in the development and popularization of future intelligent robots. In order to use the chip model EP3SL200F1152C4LN effectively in such systems, certain technical talents are required, such as knowledge of the various communication protocols and networks, as well as understanding of the various operating systems it is capable of supporting.
Overall, the chip model EP3SL200F1152C4LN is a powerful and versatile component that is capable of handling multiple tasks simultaneously. It is designed to be used in a variety of communication systems, including wireless, wired, and fiber-optic networks. It is also capable of being upgraded to meet future requirements and is capable of being used in the development and popularization of future intelligent robots. In order to use the chip model EP3SL200F1152C4LN effectively, certain technical talents are required, such as knowledge of the various communication protocols and networks, as well as understanding of the various operating systems it is capable of supporting.
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1,453 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $5,016.4516 | $5,016.4516 |
10+ | $4,962.5113 | $49,625.1128 |
100+ | $4,692.8096 | $469,280.9580 |
1000+ | $4,423.1079 | $2,211,553.9400 |
10000+ | $4,045.5255 | $4,045,525.5000 |
The price is for reference only, please refer to the actual quotation! |