Intel Corporation
EP3SL200F1152C4LG
EP3SL200F1152C4LG ECAD Model
EP3SL200F1152C4LG Attributes
| Type | Description | Select |
|---|---|---|
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Logic Cells | 200000 | |
| Number of CLBs | 8000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 8000 CLBS | |
| Additional Feature | ALSO OPERATES AT 1.1V VCC NOMINAL | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.6 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL200F1152C4LG Datasheet Download
EP3SL200F1152C4LG Overview
The chip model EP3SL200F1152C4LG is a highly integrated and powerful field-programmable gate array (FPGA) that offers a wide range of features and benefits. It is designed to meet the needs of various industries, such as telecommunications, consumer electronics, automotive, and industrial automation. This chip model has a wide range of features, including a high-performance processor, high-speed memory, and advanced I/O capabilities.
The EP3SL200F1152C4LG chip model offers several advantages over other FPGA models. It is designed to handle large amounts of data quickly and efficiently, making it ideal for applications that require high-speed data processing. It also offers a wide range of I/O interfaces, allowing it to be used in a variety of applications. In addition, the chip model is capable of supporting a variety of protocols, such as Ethernet and USB, making it suitable for use in a variety of networks and applications.
The EP3SL200F1152C4LG chip model is expected to experience increasing demand in the future as more industries adopt FPGA technology. This is due to its ability to provide high-speed data processing and its wide range of I/O interfaces. In addition, the chip model is expected to be used in more intelligent scenarios in the future, such as in the era of fully intelligent systems. This is due to its ability to support a variety of protocols, such as Ethernet and USB, as well as its high-speed data processing capabilities.
In conclusion, the EP3SL200F1152C4LG chip model is a powerful and highly integrated FPGA that offers a wide range of features and benefits. It is expected to experience increasing demand in the future due to its ability to provide high-speed data processing and its wide range of I/O interfaces. In addition, the chip model is expected to be used in more intelligent scenarios in the future, such as in the era of fully intelligent systems. Therefore, it is important to consider the industry trends of the chip model EP3SL200F1152C4LG and the future development of related industries, as well as what specific technologies are needed to support the application environment.
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5,843 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $29,875.9735 | $29,875.9735 |
| 10+ | $29,554.7265 | $295,547.2648 |
| 100+ | $27,948.4913 | $2,794,849.1349 |
| 1000+ | $26,342.2562 | $13,171,128.1070 |
| 10000+ | $24,093.5270 | $24,093,527.0250 |
| The price is for reference only, please refer to the actual quotation! | ||