Intel Corporation
EP3SL200F1152C4L
EP3SL200F1152C4L ECAD Model
EP3SL200F1152C4L Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 744 | |
| Number of Outputs | 744 | |
| Number of Logic Cells | 200000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Clock Frequency-Max | 717 MHz | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.9 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Pin Count | 1152 |
EP3SL200F1152C4L Overview
The chip model EP3SL200F1152C4L is a high-performance, low-power field-programmable gate array (FPGA) designed by Altera Corporation. This model is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language.
The EP3SL200F1152C4L has a wide range of features, including a 200K logic element array, 1152 I/O pins, a maximum operating frequency of 400MHz, and an on-chip memory of 4Mb. This FPGA has a low-power consumption design, making it an ideal choice for applications that require high performance with low power consumption.
In terms of product description, the EP3SL200F1152C4L is a high-performance, low-power FPGA that can be used for a variety of applications. It has a 200K logic element array, 1152 I/O pins, and a maximum operating frequency of 400MHz. The on-chip memory is 4Mb, and the power consumption is low.
In terms of specific design requirements, the EP3SL200F1152C4L can be used for a variety of applications, such as high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. The design of the EP3SL200F1152C4L requires knowledge of HDL language, as well as knowledge of the application domain.
In terms of actual case studies, the EP3SL200F1152C4L has been used in a variety of applications, such as video processing, image processing, and other embedded processing applications. In these applications, the EP3SL200F1152C4L has been used to achieve high performance with low power consumption.
In terms of precautions, the EP3SL200F1152C4L should be used with caution, as it is a high-performance, low-power FPGA. It should be used only in applications that require the use of HDL language and knowledge of the application domain.
When it comes to the application of the EP3SL200F1152C4L for the development and popularization of future intelligent robots, the model can be used to achieve high-performance, low-power embedded processing. However, the use of the model requires knowledge of HDL language, as well as knowledge of the application domain. In addition, the design and implementation of the EP3SL200F1152C4L should be done by experienced engineers and technical personnel.
You May Also Be Interested In
5,360 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||