Intel Corporation
EP3SL200F1152C3G
EP3SL200F1152C3G ECAD Model
EP3SL200F1152C3G Attributes
| Type | Description | Select |
|---|---|---|
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 744 | |
| Number of Outputs | 744 | |
| Number of Logic Cells | 200000 | |
| Number of CLBs | 8000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 8000 CLBS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.55 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | HBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL200F1152C3G Datasheet Download
EP3SL200F1152C3G Overview
The EP3SL200F1152C3G is a field-programmable gate array (FPGA) chip model that is designed for high-performance digital signal processing, embedded processing, image processing, and other applications. This chip model is designed to require the use of a hardware description language (HDL) to program the chip. The original design intention of this chip model was to provide a high-performance, low-cost solution for various types of digital signal processing needs.
The EP3SL200F1152C3G is capable of being upgraded and applied to advanced communication systems. This is due to its ability to be programmed in HDL, which allows for the addition of new features and capabilities. Additionally, the chip model features a low-power design that is ideal for battery-powered systems, as well as high-speed operations.
The EP3SL200F1152C3G chip model is specifically designed to provide a high-performance solution for digital signal processing needs. It features a number of features that make it suitable for a variety of applications, including a wide array of I/O options, a high-speed internal clock, and a low-power design. Additionally, the chip model is designed to be programmable in HDL, which allows for the addition of new features and capabilities.
When selecting the EP3SL200F1152C3G chip model, it is important to consider the specific design requirements of the application. For example, the power requirements, clock speed, and I/O options should all be taken into account. Additionally, it is important to consider the actual case studies and precautions associated with the chip model. This includes ensuring that the chip model is compatible with the existing system, as well as ensuring that all safety and reliability requirements are met.
Overall, the EP3SL200F1152C3G is a highly capable chip model that is designed for high-performance digital signal processing, embedded processing, image processing, and other applications. It is designed to be programmable in HDL, which allows for the addition of new features and capabilities. When selecting the chip model, it is important to consider the specific design requirements of the application, as well as the actual case studies and precautions associated with the chip model.
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1,380 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $29,590.7584 | $29,590.7584 |
| 10+ | $29,272.5782 | $292,725.7822 |
| 100+ | $27,681.6772 | $2,768,167.7226 |
| 1000+ | $26,090.7762 | $13,045,388.1180 |
| 10000+ | $23,863.5149 | $23,863,514.8500 |
| The price is for reference only, please refer to the actual quotation! | ||