EP3SL200F1152C3
EP3SL200F1152C3
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rohs

Intel Corporation

EP3SL200F1152C3


EP3SL200F1152C3
F18-EP3SL200F1152C3
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-1152
FBGA-1152

EP3SL200F1152C3 ECAD Model


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EP3SL200F1152C3 Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 900 mV
Number of Inputs 744
Number of Outputs 744
Number of Logic Cells 200000
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Additional Feature IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Clock Frequency-Max 717 MHz
Power Supplies 1.2/3.3 V
Supply Voltage-Max 940 mV
Supply Voltage-Min 860 mV
JESD-30 Code S-PBGA-B1152
Qualification Status Not Qualified
Operating Temperature-Max 85 °C
Number of Terminals 1152
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1152,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.9 mm
Ihs Manufacturer INTEL CORP
Package Description FBGA-1152
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP3SL200F1152C3 Datasheet Download


EP3SL200F1152C3 Overview



The chip model EP3SL200F1152C3 is an integrated circuit manufactured by Altera Corporation, a leading provider of programmable logic solutions. It is the latest member of the Stratix III family of FPGAs, and it is designed to provide high performance and system integration capabilities. Its original design intention was to provide a powerful, reliable, and cost-effective solution for a wide range of applications, such as advanced communication systems, networks, and intelligent systems.


The EP3SL200F1152C3 is a highly integrated device that is capable of providing enhanced system performance and system integration capabilities. It is designed to provide high-speed data transfer and low power consumption. It is also designed to allow for future upgrades, such as the addition of new features, and the ability to upgrade existing features. This makes it a great choice for applications that require a high level of performance and flexibility.


The EP3SL200F1152C3 is also suitable for use in advanced communication systems. It is capable of providing high-speed data transfer, low power consumption, and high reliability. It is also capable of providing a wide range of features, such as voice, video, and data transmission. Additionally, it is capable of providing advanced features such as packet-level switching, quality of service, and traffic shaping. This makes it a great choice for applications that require a high level of performance and flexibility.


The EP3SL200F1152C3 is also suitable for use in intelligent scenarios. It is capable of providing advanced features such as artificial intelligence, machine learning, and natural language processing. This makes it a great choice for applications that require a high level of performance and flexibility. Additionally, it is capable of providing a wide range of features, such as voice, video, and data transmission.


The EP3SL200F1152C3 is also suitable for use in the development and popularization of future intelligent robots. It is capable of providing advanced features such as artificial intelligence, machine learning, and natural language processing. Additionally, it is capable of providing a wide range of features, such as voice, video, and data transmission. This makes it a great choice for applications that require a high level of performance and flexibility.


In order to effectively use the EP3SL200F1152C3 chip model, technical talents such as engineers, designers, and software developers are needed. Engineers and designers must be familiar with the chip model, its features, and its capabilities in order to effectively design and implement solutions. Software developers must also be familiar with the chip model, its features, and its capabilities in order to effectively develop software for the model.


In conclusion, the chip model EP3SL200F1152C3 is a powerful, reliable, and cost-effective solution for a wide range of applications. It is capable of providing enhanced system performance and system integration capabilities. It is also capable of providing a wide range of features, such as voice, video, and data transmission. Additionally, it is capable of providing advanced features such as artificial intelligence, machine learning, and natural language processing. This makes it a great choice for applications that require a high level of performance and flexibility. Technical talents such as engineers, designers, and software developers are needed in order to effectively use the chip model.



2,470 In Stock


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Unit Price: $5,142.5172
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $4,782.5410 $4,782.5410
10+ $4,731.1158 $47,311.1582
100+ $4,473.9900 $447,398.9964
1000+ $4,216.8641 $2,108,432.0520
10000+ $3,856.8879 $3,856,887.9000
The price is for reference only, please refer to the actual quotation!

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