
Intel Corporation
EP3SL200F1152C3
EP3SL200F1152C3 ECAD Model
EP3SL200F1152C3 Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 744 | |
Number of Outputs | 744 | |
Number of Logic Cells | 200000 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
Clock Frequency-Max | 717 MHz | |
Power Supplies | 1.2/3.3 V | |
Supply Voltage-Max | 940 mV | |
Supply Voltage-Min | 860 mV | |
JESD-30 Code | S-PBGA-B1152 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 85 °C | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.9 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | FBGA-1152 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EP3SL200F1152C3 Datasheet Download
EP3SL200F1152C3 Overview
The chip model EP3SL200F1152C3 is an integrated circuit manufactured by Altera Corporation, a leading provider of programmable logic solutions. It is the latest member of the Stratix III family of FPGAs, and it is designed to provide high performance and system integration capabilities. Its original design intention was to provide a powerful, reliable, and cost-effective solution for a wide range of applications, such as advanced communication systems, networks, and intelligent systems.
The EP3SL200F1152C3 is a highly integrated device that is capable of providing enhanced system performance and system integration capabilities. It is designed to provide high-speed data transfer and low power consumption. It is also designed to allow for future upgrades, such as the addition of new features, and the ability to upgrade existing features. This makes it a great choice for applications that require a high level of performance and flexibility.
The EP3SL200F1152C3 is also suitable for use in advanced communication systems. It is capable of providing high-speed data transfer, low power consumption, and high reliability. It is also capable of providing a wide range of features, such as voice, video, and data transmission. Additionally, it is capable of providing advanced features such as packet-level switching, quality of service, and traffic shaping. This makes it a great choice for applications that require a high level of performance and flexibility.
The EP3SL200F1152C3 is also suitable for use in intelligent scenarios. It is capable of providing advanced features such as artificial intelligence, machine learning, and natural language processing. This makes it a great choice for applications that require a high level of performance and flexibility. Additionally, it is capable of providing a wide range of features, such as voice, video, and data transmission.
The EP3SL200F1152C3 is also suitable for use in the development and popularization of future intelligent robots. It is capable of providing advanced features such as artificial intelligence, machine learning, and natural language processing. Additionally, it is capable of providing a wide range of features, such as voice, video, and data transmission. This makes it a great choice for applications that require a high level of performance and flexibility.
In order to effectively use the EP3SL200F1152C3 chip model, technical talents such as engineers, designers, and software developers are needed. Engineers and designers must be familiar with the chip model, its features, and its capabilities in order to effectively design and implement solutions. Software developers must also be familiar with the chip model, its features, and its capabilities in order to effectively develop software for the model.
In conclusion, the chip model EP3SL200F1152C3 is a powerful, reliable, and cost-effective solution for a wide range of applications. It is capable of providing enhanced system performance and system integration capabilities. It is also capable of providing a wide range of features, such as voice, video, and data transmission. Additionally, it is capable of providing advanced features such as artificial intelligence, machine learning, and natural language processing. This makes it a great choice for applications that require a high level of performance and flexibility. Technical talents such as engineers, designers, and software developers are needed in order to effectively use the chip model.
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2,470 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $4,782.5410 | $4,782.5410 |
10+ | $4,731.1158 | $47,311.1582 |
100+ | $4,473.9900 | $447,398.9964 |
1000+ | $4,216.8641 | $2,108,432.0520 |
10000+ | $3,856.8879 | $3,856,887.9000 |
The price is for reference only, please refer to the actual quotation! |