Intel Corporation
EP3SL150F780I4LG
EP3SL150F780I4LG ECAD Model
EP3SL150F780I4LG Attributes
| Type | Description | Select |
|---|---|---|
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Logic Cells | 142500 | |
| Number of CLBs | 5700 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Organization | 5700 CLBS | |
| Additional Feature | ALSO OPERATES AT 1.1V VCC NOMINAL | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.2 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-780 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL150F780I4LG Datasheet Download
EP3SL150F780I4LG Overview
The chip model EP3SL150F780I4LG is an integrated circuit manufactured by Altera, a well-known semiconductor manufacturer. It is widely used in various industries and is known for its high performance and reliability. This chip model is designed for high-speed communication and data transfer applications, and it can be used in various communication systems, such as Ethernet and Wi-Fi.
In terms of industry trends, this chip model is becoming increasingly popular due to its high performance and reliability. It is being used in more and more industries, including automotive, industrial, medical, and consumer electronics. It is also being used in advanced communication systems, such as 5G networks. The chip model is also being used in the era of fully intelligent systems, where it is being used to enable the development of intelligent scenarios.
As for the future development of related industries, the chip model EP3SL150F780I4LG is likely to be used in more and more applications due to its high performance and reliability. It is also likely to be used in more advanced communication systems, such as 6G networks. It is also possible that the chip model may be used in more intelligent scenarios, such as autonomous driving, intelligent homes, and intelligent factories.
In terms of the original design intention of the chip model EP3SL150F780I4LG, it was designed to provide high-speed communication and data transfer capabilities. It is also designed to be reliable and robust, and it is capable of handling large amounts of data. It is also designed to be upgradeable, and it is possible that the chip model may be upgraded in the future to support new technologies.
Overall, the chip model EP3SL150F780I4LG is an excellent choice for high-speed communication and data transfer applications. It is reliable and robust, and it is being used in more and more industries and applications. It is also being used in advanced communication systems, such as 5G networks, and it is also being used in the era of fully intelligent systems. It is also possible that the chip model may be upgraded in the future to support new technologies.
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1,507 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $6,254.5625 | $6,254.5625 |
| 10+ | $6,187.3091 | $61,873.0912 |
| 100+ | $5,851.0423 | $585,104.2320 |
| 1000+ | $5,514.7755 | $2,757,387.7600 |
| 10000+ | $5,044.0020 | $5,044,002.0000 |
| The price is for reference only, please refer to the actual quotation! | ||