
Intel Corporation
EP3SL150F780I4G
EP3SL150F780I4G ECAD Model
EP3SL150F780I4G Attributes
Type | Description | Select |
---|---|---|
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 488 | |
Number of Outputs | 488 | |
Number of Logic Cells | 142500 | |
Number of CLBs | 5700 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Organization | 5700 CLBS | |
Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
Supply Voltage-Max | 940 mV | |
Supply Voltage-Min | 860 mV | |
JESD-30 Code | S-PBGA-B780 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 780 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA780,28X28,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 29 mm | |
Length | 29 mm | |
Seated Height-Max | 3 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | FBGA-780 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EP3SL150F780I4G Datasheet Download
EP3SL150F780I4G Overview
The chip model EP3SL150F780I4G is a cutting-edge product from Altera Corporation, a leading provider of programmable logic solutions. This model is designed to meet the demands of high-performance applications, such as advanced communication systems. It is a powerful and versatile chip model that offers a wide range of advantages and possibilities.
The EP3SL150F780I4G chip model is designed to provide high-performance, low-power operation, and a wide range of features. It is ideal for applications that require high-speed, low-power operation and a wide range of features. The model features a dual-core processor, a high-speed memory controller, a high-speed serial interface, a high-speed peripheral interface, and a wide range of other features.
The chip model EP3SL150F780I4G is designed to offer a wide range of advantages and possibilities. It is designed to provide high-performance, low-power operation, and a wide range of features. It is designed to provide a wide range of features, including a high-speed memory controller, a high-speed serial interface, a high-speed peripheral interface, and a wide range of other features. The model is also designed to be highly configurable and upgradable, allowing for easy customization and future upgrades.
The EP3SL150F780I4G chip model is designed to meet the demands of advanced communication systems. It is designed to provide high-performance, low-power operation, and a wide range of features. The model is designed to be highly configurable and upgradable, allowing for easy customization and future upgrades. The model is also designed to be highly reliable and robust, ensuring that it can meet the demands of advanced communication systems.
The product description and specific design requirements of the chip model EP3SL150F780I4G are detailed in the product specification document. This document outlines the design goals, features, and requirements of the model, as well as the specific design requirements and considerations. The document also outlines the actual case studies and precautions for using the model.
The EP3SL150F780I4G chip model is designed to meet the demands of high-performance applications, such as advanced communication systems. It offers a wide range of advantages and possibilities, including a dual-core processor, a high-speed memory controller, a high-speed serial interface, a high-speed peripheral interface, and a wide range of other features. It is designed to be highly configurable and upgradable, allowing for easy customization and future upgrades. The product description and specific design requirements of the model are detailed in the product specification document, as well as actual case studies and precautions for using the model.
The chip model EP3SL150F780I4G offers a wide range of advantages and possibilities and is expected to experience high demand in related industries in the future. The model is designed to provide high-performance, low-power operation, and a wide range of features. It is also designed to be highly configurable and upgradable, allowing for easy customization and future upgrades. The product description and specific design requirements of the model are detailed in the product specification document, as well as actual case studies and precautions for using the model. With its wide range of advantages and possibilities, the EP3SL150F780I4G chip model is expected to experience high demand in related industries in the future.
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4,138 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $4,811.2099 | $4,811.2099 |
10+ | $4,759.4765 | $47,594.7648 |
100+ | $4,500.8093 | $450,080.9280 |
1000+ | $4,242.1421 | $2,121,071.0400 |
10000+ | $3,880.0080 | $3,880,008.0000 |
The price is for reference only, please refer to the actual quotation! |