EP3SL150F780C2G
EP3SL150F780C2G
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rohs

Intel Corporation

EP3SL150F780C2G


EP3SL150F780C2G
F18-EP3SL150F780C2G
Active
FIELD PROGRAMMABLE GATE ARRAY, FBGA-780
FBGA-780

EP3SL150F780C2G ECAD Model


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EP3SL150F780C2G Attributes


Type Description Select
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 488
Number of Outputs 488
Number of Logic Cells 142500
Number of CLBs 5700
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Organization 5700 CLBS
Additional Feature IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Supply Voltage-Max 940 mV
Supply Voltage-Min 860 mV
JESD-30 Code S-PBGA-B780
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 780
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA780,28X28,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 29 mm
Length 29 mm
Seated Height-Max 3 mm
Ihs Manufacturer INTEL CORP
Package Description FBGA-780
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP3SL150F780C2G Datasheet Download


EP3SL150F780C2G Overview



The chip model EP3SL150F780C2G is a highly advanced piece of technology that has been designed to meet the needs of modern communication systems. This chip model is an FPGA-based device that features a high-performance processor, a large memory, and a wide range of I/O capabilities. It is also equipped with a low-power consumption design, making it an ideal choice for applications that require high-performance computing without draining too much power.


The EP3SL150F780C2G offers a number of advantages that make it an attractive choice for many industries. It has a very low power consumption, making it an ideal choice for applications that require high-performance computing without draining too much power. Additionally, its large memory capacity allows it to store large amounts of data, making it suitable for applications that require large data sets. Furthermore, its wide range of I/O capabilities makes it suitable for a wide range of applications, including data transfer, communication, and control systems.


The EP3SL150F780C2G is expected to experience a growing demand in the future as more industries adopt this technology. Its low power consumption and high-performance capabilities make it an ideal choice for applications that require high-performance computing without draining too much power. Additionally, its large memory capacity makes it suitable for applications that require large data sets, such as data transfer, communication, and control systems.


The original design intention of the EP3SL150F780C2G was to provide a highly advanced chip model that could be used for a wide variety of applications. The chip model was designed with the intention of being able to be used in advanced communication systems and networks, as well as being able to be used in the era of fully intelligent systems. It is possible to upgrade the chip model in the future, allowing it to be used in even more advanced applications.


The EP3SL150F780C2G is a highly advanced chip model that has a wide range of possible applications. It can be used in networks and communication systems, as well as in the era of fully intelligent systems. This chip model can be used for data transfer, communication, and control systems, as well as for applications that require large data sets. Additionally, its low power consumption makes it ideal for applications that require high-performance computing without draining too much power. As the demand for this chip model continues to grow, it is likely that it will be used in even more advanced applications in the future.



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Unit Price: $22,250.6612
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Pricing (USD)

QTY Unit Price Ext Price
1+ $20,693.1149 $20,693.1149
10+ $20,470.6083 $204,706.0830
100+ $19,358.0752 $1,935,807.5244
1000+ $18,245.5422 $9,122,771.0920
10000+ $16,687.9959 $16,687,995.9000
The price is for reference only, please refer to the actual quotation!

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