Intel Corporation
EP3SL150F780C2
EP3SL150F780C2 ECAD Model
EP3SL150F780C2 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 488 | |
| Number of Outputs | 488 | |
| Number of Logic Cells | 142500 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Clock Frequency-Max | 800 MHz | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-780 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL150F780C2 Datasheet Download
EP3SL150F780C2 Overview
The EP3SL150F780C2 chip model is an advanced, high-performance device designed for digital signal processing, embedded processing, and image processing applications. It is based on a modern architecture that enables the use of the HDL language, making it suitable for more complex tasks.
The EP3SL150F780C2 chip model was designed with the intention of providing high-performance capabilities, scalability, and flexibility. It can be upgraded to support future technologies, such as advanced communication systems. It is also designed to be compatible with a wide range of development platforms, making it an ideal choice for many different applications.
The EP3SL150F780C2 chip model has a number of features that make it suitable for a variety of tasks. It features an integrated high-speed processor, a large memory capacity, and a variety of I/O ports. It also has an advanced power management system that can reduce power consumption and improve system performance.
In addition to its technical specifications, the EP3SL150F780C2 chip model also comes with a number of design requirements. It is important to consider the type of application it will be used for, as well as the type of environment it will be used in. It is also important to consider the size and weight of the device, as well as the power requirements.
To ensure the best performance from the EP3SL150F780C2 chip model, it is important to follow the manufacturer's instructions and guidelines. It is also important to consider the type of development platform it will be used on, as well as any additional hardware or software that may be required.
Finally, there are a number of case studies and examples that can be used to help understand the capabilities of the EP3SL150F780C2 chip model. These studies can provide insight into the performance of the device and help to identify potential issues that may arise. Additionally, it is important to take into account any potential safety or security concerns that may arise when using the device.
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4,496 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $3,777.9557 | $3,777.9557 |
| 10+ | $3,737.3326 | $37,373.3256 |
| 100+ | $3,534.2167 | $353,421.6660 |
| 1000+ | $3,331.1008 | $1,665,550.3800 |
| 10000+ | $3,046.7385 | $3,046,738.5000 |
| The price is for reference only, please refer to the actual quotation! | ||