EP3SL150F1152C3G
EP3SL150F1152C3G
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rohs

Intel Corporation

EP3SL150F1152C3G


EP3SL150F1152C3G
F18-EP3SL150F1152C3G
Active
FIELD PROGRAMMABLE GATE ARRAY, HBGA-1152
HBGA-1152

EP3SL150F1152C3G ECAD Model


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EP3SL150F1152C3G Attributes


Type Description Select
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 744
Number of Outputs 744
Number of Logic Cells 142500
Number of CLBs 5700
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Organization 5700 CLBS
Additional Feature IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Supply Voltage-Max 940 mV
Supply Voltage-Min 860 mV
JESD-30 Code S-PBGA-B1152
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1152
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1152,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer INTEL CORP
Package Description HBGA-1152
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP3SL150F1152C3G Datasheet Download


EP3SL150F1152C3G Overview



The chip model EP3SL150F1152C3G is an innovative design that has been developed to meet the demands of high-performance digital signal processing, embedded processing, and image processing. It is a powerful, yet efficient solution that is capable of delivering excellent performance and reliability. The chip model is designed to be used with the HDL language, which makes it easier to develop and maintain complex applications.


The EP3SL150F1152C3G chip model offers several advantages, such as low power consumption, high-speed operation, and low latency. It can also handle complex calculations that require high-performance processing. Additionally, it is highly scalable, allowing it to be upgraded as technology advances. Furthermore, the chip model can be used in advanced communication systems, providing a reliable and secure platform for data transmission and reception.


The EP3SL150F1152C3G chip model is expected to be in high demand in the future, as its features and capabilities are increasingly sought after. It is a robust design that can be used in a variety of applications, from image processing to embedded processing. Its scalability also allows it to be upgraded as technology advances, ensuring that it remains relevant and useful.


The original design intention of the chip model EP3SL150F1152C3G was to provide a high-performance and reliable solution for digital signal processing, embedded processing, and image processing. It is a powerful, yet efficient solution that is capable of delivering excellent performance and reliability. The chip model is designed to be used with the HDL language, which makes it easier to develop and maintain complex applications. Furthermore, its scalability allows it to be upgraded as technology advances, ensuring that it remains relevant and useful in the future.


Overall, the EP3SL150F1152C3G chip model is an excellent solution for high-performance digital signal processing, embedded processing, and image processing. It is a powerful yet efficient solution that is capable of delivering excellent performance and reliability. Its scalability also allows it to be upgraded as technology advances, ensuring that it remains relevant and useful in the future. Its use of the HDL language also makes it easier to develop and maintain complex applications. As technology advances and demand for this chip model increases, its scalability and versatility will make it an invaluable tool for advanced communication systems.



3,825 In Stock


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Unit Price: $19,257.0371
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Pricing (USD)

QTY Unit Price Ext Price
1+ $17,909.0445 $17,909.0445
10+ $17,716.4741 $177,164.7413
100+ $16,753.6223 $1,675,362.2277
1000+ $15,790.7704 $7,895,385.2110
10000+ $14,442.7778 $14,442,777.8250
The price is for reference only, please refer to the actual quotation!

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