EP3SL150F1152C3
EP3SL150F1152C3
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rohs

Intel Corporation

EP3SL150F1152C3


EP3SL150F1152C3
F18-EP3SL150F1152C3
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-1152
FBGA-1152

EP3SL150F1152C3 ECAD Model


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EP3SL150F1152C3 Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 900 mV
Number of Inputs 744
Number of Outputs 744
Number of Logic Cells 142500
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Additional Feature IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Clock Frequency-Max 717 MHz
Power Supplies 1.2/3.3 V
Supply Voltage-Max 940 mV
Supply Voltage-Min 860 mV
JESD-30 Code S-PBGA-B1152
Qualification Status Not Qualified
Operating Temperature-Max 85 °C
Number of Terminals 1152
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1152,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.9 mm
Ihs Manufacturer INTEL CORP
Package Description FBGA-1152
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP3SL150F1152C3 Datasheet Download


EP3SL150F1152C3 Overview



The chip model EP3SL150F1152C3 is an important part of the development of intelligent networks and systems. This model has the potential to be used in a wide range of applications, from simple networks to fully intelligent systems. It is also possible to use this model in the development and popularization of future intelligent robots.


The EP3SL150F1152C3 is a low-power, low-cost, high-performance Field Programmable Gate Array (FPGA) chip. This chip model is designed to meet the needs of high-speed, high-density network applications. It has a wide range of features, including: high-speed data transfer, low-power operation, and high-density integration. This chip model also supports multiple instruction sets, making it suitable for a variety of applications.


This chip model is suitable for a wide range of intelligent scenarios. It can be used to create intelligent networks, such as those used in smart cities, autonomous vehicles, and robotics. It can also be used to develop intelligent robots, such as those used in medical, industrial, and military applications. Additionally, this chip model can be used for the development of artificial intelligence (AI) systems.


In order to use the EP3SL150F1152C3 effectively, certain technical talents are required. These include knowledge of FPGA design, embedded systems, and digital signal processing. Additionally, knowledge of computer architecture and software engineering is also essential.


In order to get the most out of this chip model, it is important to understand the product description and specific design requirements of the EP3SL150F1152C3. This includes understanding the chip's features, capabilities, and limitations. Additionally, it is important to be aware of the actual case studies and precautions related to the chip model.


The EP3SL150F1152C3 is a powerful chip model that has the potential to be used in a wide range of applications. It is suitable for a variety of intelligent scenarios, from simple networks to fully intelligent systems. Furthermore, this chip model is also suitable for the development and popularization of future intelligent robots. In order to use the chip model effectively, certain technical talents are required, and it is important to understand the product description and specific design requirements of the chip model. With the right knowledge and expertise, the EP3SL150F1152C3 can be used to create powerful intelligent networks and systems.



4,198 In Stock


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Unit Price: $3,195.0047
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Pricing (USD)

QTY Unit Price Ext Price
1+ $2,971.3544 $2,971.3544
10+ $2,939.4043 $29,394.0432
100+ $2,779.6541 $277,965.4089
1000+ $2,619.9039 $1,309,951.9270
10000+ $2,396.2535 $2,396,253.5250
The price is for reference only, please refer to the actual quotation!

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