Intel Corporation
EP3SL150F1152C2
EP3SL150F1152C2 ECAD Model
EP3SL150F1152C2 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 744 | |
| Number of Outputs | 744 | |
| Number of Logic Cells | 142500 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Clock Frequency-Max | 800 MHz | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.9 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL150F1152C2 Datasheet Download
EP3SL150F1152C2 Overview
The chip model EP3SL150F1152C2 is a powerful tool that can be used in a variety of industries. It is an advanced system-on-chip (SoC) that is designed to provide high-speed, low-power performance. As the industry trends and future development of related industries continue to evolve, this chip model is likely to become even more useful.
In terms of industry trends, the EP3SL150F1152C2 chip model is being used in a variety of applications, such as networks, intelligent systems, and robots. It is capable of providing high-speed performance and low-power consumption. This makes it an ideal choice for those looking to use the latest technology in their applications. Furthermore, the chip model is also capable of supporting new technologies, such as artificial intelligence (AI) and machine learning (ML).
In terms of possible future applications, the EP3SL150F1152C2 chip model could be used in networks, intelligent systems, and robots. It could also be used in the era of fully intelligent systems. For example, the chip model could be used to create intelligent robots that are capable of performing complex tasks. Additionally, the chip model could be used to develop and popularize future intelligent robots.
In terms of technical talents needed to use the model effectively, the EP3SL150F1152C2 chip model requires professionals with knowledge in the areas of AI, ML, and robotics. These professionals should have a good understanding of the underlying algorithms, architectures, and technologies that are used to make the chip model work. Additionally, they should have a good understanding of how to integrate the chip model into existing systems and how to optimize its performance.
Overall, the chip model EP3SL150F1152C2 is a powerful tool that can be used in a variety of industries. It is capable of providing high-speed performance and low-power consumption, making it an ideal choice for those looking to use the latest technology in their applications. Furthermore, it can be used in networks, intelligent systems, and robots, and can even be used in the era of fully intelligent systems. Lastly, professionals with knowledge in the areas of AI, ML, and robotics are needed to use the model effectively.
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1,330 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $3,863.2331 | $3,863.2331 |
| 10+ | $3,821.6930 | $38,216.9297 |
| 100+ | $3,613.9923 | $361,399.2267 |
| 1000+ | $3,406.2916 | $1,703,145.7810 |
| 10000+ | $3,115.5106 | $3,115,510.5750 |
| The price is for reference only, please refer to the actual quotation! | ||