EP3SL110F780I4LG
EP3SL110F780I4LG
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rohs

Intel Corporation

EP3SL110F780I4LG


EP3SL110F780I4LG
F18-EP3SL110F780I4LG
Active
FIELD PROGRAMMABLE GATE ARRAY, FBGA-780
FBGA-780

EP3SL110F780I4LG ECAD Model


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EP3SL110F780I4LG Attributes


Type Description Select
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Logic Cells 107500
Number of CLBs 4300
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Organization 4300 CLBS
Additional Feature ALSO OPERATES AT 1.1V VCC NOMINAL
Supply Voltage-Max 940 mV
Supply Voltage-Min 860 mV
JESD-30 Code S-PBGA-B780
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 780
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA780,28X28,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 29 mm
Length 29 mm
Seated Height-Max 3.2 mm
Ihs Manufacturer INTEL CORP
Package Description FBGA-780
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP3SL110F780I4LG Datasheet Download


EP3SL110F780I4LG Overview



The chip model EP3SL110F780I4LG is a high-performance digital signal processing, embedded processing, and image processing chip that is designed to be used with the HDL language. It is a powerful and versatile tool for engineers and developers alike, allowing them to quickly and easily create complex systems.


The EP3SL110F780I4LG chip model has many advantages, such as a low power consumption, a high speed, and a small form factor. These features make it suitable for a wide range of applications, from industrial automation to consumer electronics. Additionally, the chip model offers a wide range of features and capabilities, such as a built-in memory controller, and a high-speed bus interface.


The EP3SL110F780I4LG chip model is expected to be in high demand in the near future, as the need for high-performance digital signal processing, embedded processing, and image processing chips increases. This is due to the growing demand for more powerful and efficient systems in industrial, automotive, and consumer electronics applications.


The EP3SL110F780I4LG chip model is also expected to be used in networks and intelligent scenarios in the future. It is likely that the chip will be used in networked systems, such as the Internet of Things (IoT), as well as in intelligent systems, such as autonomous vehicles, robotics, and artificial intelligence (AI). The chip model's features and capabilities make it suitable for these types of applications.


The EP3SL110F780I4LG chip model is also expected to be used in the era of fully intelligent systems. Its features and capabilities make it suitable for use in AI-driven systems, as it has the necessary computing power and memory capacity to handle the complex calculations and data processing required for such systems. Additionally, its low power consumption and small form factor make it ideal for use in small, low-power devices.


In conclusion, the EP3SL110F780I4LG chip model is an ideal choice for high-performance digital signal processing, embedded processing, and image processing applications. Its features and capabilities make it suitable for a wide range of applications, from industrial automation to consumer electronics. It is also expected to be in high demand in the near future, as the need for more powerful and efficient systems increases. Finally, the chip model is expected to be used in networks and intelligent scenarios in the future, as well as in the era of fully intelligent systems.



4,961 In Stock


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Unit Price: $3,661.184
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Pricing (USD)

QTY Unit Price Ext Price
1+ $3,404.9011 $3,404.9011
10+ $3,368.2893 $33,682.8928
100+ $3,185.2301 $318,523.0080
1000+ $3,002.1709 $1,501,085.4400
10000+ $2,745.8880 $2,745,888.0000
The price is for reference only, please refer to the actual quotation!

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