Intel Corporation
EP3SL110F780I4G
EP3SL110F780I4G ECAD Model
EP3SL110F780I4G Attributes
| Type | Description | Select |
|---|---|---|
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 488 | |
| Number of Outputs | 488 | |
| Number of Logic Cells | 107500 | |
| Number of CLBs | 4300 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Organization | 4300 CLBS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-780 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL110F780I4G Datasheet Download
EP3SL110F780I4G Overview
The chip model EP3SL110F780I4G is a high-performance integrated circuit designed for digital signal processing, embedded processing, and image processing. It requires the use of HDL language for programming and implementation. This chip model is suitable for wide range of applications, including consumer electronics, automotive, industrial, aerospace, and medical.
The EP3SL110F780I4G chip model is designed for high-speed data processing, making it suitable for advanced communication systems. It is designed to provide high-performance signal processing and image processing capabilities. The chip model is also designed to be upgradeable, allowing users to add new features and technologies to their systems.
The industry trends of the chip model EP3SL110F780I4G and the future development of related industries are largely dependent on the specific technologies needed. As technology advances, the chip model will require new features and technologies to keep up with industry standards. This could include support for new communication protocols, new image processing algorithms, and other features.
The original design intention of the chip model EP3SL110F780I4G was to provide a powerful and reliable signal processing solution for users. Its design also allows for future upgrades, allowing users to add new features and technologies to their systems as needed. This makes it suitable for a wide range of applications, from consumer electronics to advanced communication systems.
Overall, the chip model EP3SL110F780I4G is a powerful and reliable solution for digital signal processing, embedded processing, and image processing. Its design allows for future upgrades, making it suitable for a wide range of applications. The industry trends and future development of related industries are largely dependent on the specific technologies needed, and the chip model is designed to provide a powerful and reliable signal processing solution.
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3,429 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $8,639.8952 | $8,639.8952 |
| 10+ | $8,546.9931 | $85,469.9311 |
| 100+ | $8,082.4826 | $808,248.2613 |
| 1000+ | $7,617.9721 | $3,808,986.0590 |
| 10000+ | $6,967.6574 | $6,967,657.4250 |
| The price is for reference only, please refer to the actual quotation! | ||