Intel Corporation
EP3SL110F780C3G
EP3SL110F780C3G ECAD Model
EP3SL110F780C3G Attributes
| Type | Description | Select |
|---|---|---|
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 488 | |
| Number of Outputs | 488 | |
| Number of Logic Cells | 107500 | |
| Number of CLBs | 4300 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 4300 CLBS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-780 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL110F780C3G Datasheet Download
EP3SL110F780C3G Overview
The chip model EP3SL110F780C3G is a highly advanced and sophisticated system on a chip (SoC) developed by Altera Corporation. It is designed to provide a wide range of features and functions to meet the needs of today’s ever-changing communication systems. The chip model EP3SL110F780C3G is a single-chip solution that can be used to build a variety of advanced communication systems, such as wireless networks, cellular networks, and satellite communications.
The original design intention of the chip model EP3SL110F780C3G was to provide a high performance and cost-effective solution for advanced communication systems. It is designed to provide a wide range of features and functions, including support for multiple protocols, high-speed data transmission, and low power consumption. Additionally, the chip model EP3SL110F780C3G is capable of supporting a variety of intelligent scenarios, such as voice recognition, facial recognition, and natural language processing.
The chip model EP3SL110F780C3G is also capable of being upgraded for future applications. It is designed to be easily upgradable and customizable, allowing users to quickly and easily add new features and functions to their communication systems. Additionally, the chip model EP3SL110F780C3G is capable of being used in the era of fully intelligent systems, as it is designed to be compatible with a variety of artificial intelligence (AI) technologies.
The product description and specific design requirements of the chip model EP3SL110F780C3G are available on the Altera Corporation website. The chip model EP3SL110F780C3G is designed to meet the needs of today’s ever-changing communication systems, and it is capable of providing a wide range of features and functions to meet the demands of these systems. Additionally, the chip model EP3SL110F780C3G is designed to be easily upgradable and customizable, allowing users to quickly and easily add new features and functions to their communication systems.
In addition to the product description and design requirements, there are also actual case studies and precautions available for the chip model EP3SL110F780C3G. These case studies and precautions provide users with information on how to properly use the chip model EP3SL110F780C3G in their communication systems. Additionally, these case studies and precautions provide users with information on how to properly upgrade and customize the chip model EP3SL110F780C3G, as well as how to properly use it in the era of fully intelligent systems.
In conclusion, the chip model EP3SL110F780C3G is a highly advanced and sophisticated system on a chip (SoC) developed by Altera Corporation. It is designed to provide a wide range of features and functions to meet the needs of today’s ever-changing communication systems. The original design intention of the chip model EP3SL110F780C3G was to provide a high performance and cost-effective solution for advanced communication systems, and it is capable of being used in the era of fully intelligent systems. Additionally, the chip model EP3SL110F780C3G is designed to be easily upgradable and customizable, allowing users to quickly and easily add new features and functions to their communication systems. The product description and specific design requirements of the chip model EP3SL110F780C3G are available on the Altera Corporation website, along with actual case studies and precautions.
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4,626 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,619.8026 | $2,619.8026 |
| 10+ | $2,591.6326 | $25,916.3264 |
| 100+ | $2,450.7830 | $245,078.3040 |
| 1000+ | $2,309.9334 | $1,154,966.7200 |
| 10000+ | $2,112.7440 | $2,112,744.0000 |
| The price is for reference only, please refer to the actual quotation! | ||