Intel Corporation
EP3SL110F780C2G
EP3SL110F780C2G ECAD Model
EP3SL110F780C2G Attributes
| Type | Description | Select |
|---|---|---|
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 488 | |
| Number of Outputs | 488 | |
| Number of Logic Cells | 107500 | |
| Number of CLBs | 4300 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 4300 CLBS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-780 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL110F780C2G Datasheet Download
EP3SL110F780C2G Overview
The EP3SL110F780C2G chip model is an advanced communication system chip developed by Altera Corporation. It is designed to provide the highest level of flexibility and performance for a wide range of applications. This chip is designed to meet the needs of today's increasingly complex communication systems, such as for wireless and wired networks, as well as for advanced signal processing applications.
The EP3SL110F780C2G chip model is a single-chip solution that combines FPGA, high-speed transceivers, and advanced memory technologies in a single package. It is designed to be a highly reliable and flexible system-on-chip solution that can be used in a variety of applications. It can be used in a wide range of communication systems, including wireless, wired, and signal processing applications.
The EP3SL110F780C2G chip model is designed to be highly reliable and cost-effective. It is designed to be able to withstand extreme temperatures and other environmental conditions. It is also designed to be highly efficient and power-efficient. It is designed to be able to provide high levels of performance while consuming low levels of power.
The EP3SL110F780C2G chip model has the potential to be used in advanced communication systems. It has the capability to support a wide range of applications, such as for wireless, wired, and signal processing applications. It can also be used in a variety of intelligent scenarios, such as for intelligent networks, intelligent sensors, and intelligent systems.
The EP3SL110F780C2G chip model has a number of specific design requirements. It is designed to be highly reliable and power-efficient, and to be able to withstand extreme temperatures and other environmental conditions. It is also designed to be able to provide high levels of performance while consuming low levels of power. Additionally, it is designed to be able to support a wide range of applications, including for wireless, wired, and signal processing applications.
In order to ensure the successful use of the EP3SL110F780C2G chip model, there are a number of precautions that must be taken. It is important to ensure that the chip is properly installed and configured. It is also important to ensure that the system is properly designed and tested before deployment. Additionally, it is important to ensure that the system is regularly maintained and monitored.
The EP3SL110F780C2G chip model is a highly reliable and cost-effective solution for a wide range of communication systems. It has the potential to be used in a variety of intelligent scenarios, and can support a wide range of applications. In order to ensure the successful use of the EP3SL110F780C2G chip model, it is important to ensure that the chip is properly installed and configured, and that the system is properly designed and tested before deployment. Additionally, it is important to ensure that the system is regularly maintained and monitored.
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3,664 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $12,874.3355 | $12,874.3355 |
| 10+ | $12,735.9018 | $127,359.0178 |
| 100+ | $12,043.7332 | $1,204,373.3205 |
| 1000+ | $11,351.5646 | $5,675,782.3150 |
| 10000+ | $10,382.5286 | $10,382,528.6250 |
| The price is for reference only, please refer to the actual quotation! | ||