Intel Corporation
EP3SL110F780C2
EP3SL110F780C2 ECAD Model
EP3SL110F780C2 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 488 | |
| Number of Outputs | 488 | |
| Number of Logic Cells | 107500 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Clock Frequency-Max | 800 MHz | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-780 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL110F780C2 Datasheet Download
EP3SL110F780C2 Overview
The chip model EP3SL110F780C2 is a high-performance digital signal processing, embedded processing, and image processing device that is suitable for a wide range of applications. This chip model requires the use of HDL language, which is a hardware description language that is used to create digital circuits for use in embedded systems. It is designed to allow for the easy and efficient development of complex hardware designs.
The industry trends of the chip model EP3SL110F780C2 and the future development of related industries will depend on what specific technologies are needed. As the demand for intelligent robots and other automated systems increases, the need for new technologies that can support the development of these systems will also increase. As such, the EP3SL110F780C2 can be used to develop and popularize future intelligent robots.
In order to use the chip model EP3SL110F780C2 effectively, technical talents with knowledge of HDL language and embedded systems are necessary. This includes knowledge of embedded systems design, HDL programming, and digital signal processing. Additionally, knowledge of computer architecture, microcontrollers, and other hardware components are also required in order to effectively use the chip model.
Overall, the chip model EP3SL110F780C2 is a versatile and powerful digital signal processing, embedded processing, and image processing device that can be used to develop and popularize future intelligent robots. In order to use the chip model effectively, technical talents with knowledge of HDL language, embedded systems, and other hardware components are necessary.
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4,907 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,080.4193 | $2,080.4193 |
| 10+ | $2,058.0492 | $20,580.4920 |
| 100+ | $1,946.1987 | $194,619.8700 |
| 1000+ | $1,834.3482 | $917,174.1000 |
| 10000+ | $1,677.7575 | $1,677,757.5000 |
| The price is for reference only, please refer to the actual quotation! | ||