Intel Corporation
EP3SL110F1152I4LG
EP3SL110F1152I4LG ECAD Model
EP3SL110F1152I4LG Attributes
| Type | Description | Select |
|---|---|---|
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Logic Cells | 107500 | |
| Number of CLBs | 4300 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Organization | 4300 CLBS | |
| Additional Feature | ALSO OPERATES AT 1.1V VCC NOMINAL | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL110F1152I4LG Datasheet Download
EP3SL110F1152I4LG Overview
The chip model EP3SL110F1152I4LG is a product of the advanced semiconductor industry and is one of the most promising products in the industry. It is a field-programmable gate array (FPGA) with a wide range of applications in various industries. This chip model is designed with the latest technologies in mind and is capable of providing high performance and low power consumption.
The EP3SL110F1152I4LG chip model has been designed to meet the requirements of a wide range of applications, including communication systems, networks, and intelligent scenarios. It is equipped with a high-performance processor, a high-speed memory, and a large number of I/O ports. This chip model is designed to be highly flexible, allowing for easy customization and scalability. It is also designed to be highly reliable and efficient, providing a low power consumption rate.
The EP3SL110F1152I4LG chip model is designed to be easily upgradable and can be used in the latest communication systems. It is capable of supporting the latest technologies, such as 5G, Wi-Fi 6, and Bluetooth 5.0. This chip model can also be used in the era of fully intelligent systems, as it is equipped with the latest artificial intelligence technologies. It can be used in a variety of networks and intelligent scenarios, such as smart home and smart city applications.
The EP3SL110F1152I4LG chip model is designed to be highly reliable and efficient, providing a low power consumption rate. It is also designed with the latest technologies in mind and is capable of providing high performance and low power consumption. This chip model is designed to be highly flexible, allowing for easy customization and scalability. It is also designed to be easily upgradable and can be used in the latest communication systems.
In conclusion, the EP3SL110F1152I4LG chip model is a highly reliable and efficient product, designed to be easily upgradable and capable of supporting the latest technologies. It is designed to be highly flexible and can be used in a variety of networks and intelligent scenarios. It is also capable of providing high performance and low power consumption. The EP3SL110F1152I4LG chip model is a promising product in the advanced semiconductor industry and is sure to be an important part of the future of the industry.
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1,333 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $11,735.8161 | $11,735.8161 |
| 10+ | $11,609.6245 | $116,096.2453 |
| 100+ | $10,978.6667 | $1,097,866.6677 |
| 1000+ | $10,347.7088 | $5,173,854.4110 |
| 10000+ | $9,464.3678 | $9,464,367.8250 |
| The price is for reference only, please refer to the actual quotation! | ||