
Intel Corporation
EP3SL110F1152I4G
EP3SL110F1152I4G ECAD Model
EP3SL110F1152I4G Attributes
Type | Description | Select |
---|---|---|
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 744 | |
Number of Outputs | 744 | |
Number of Logic Cells | 107500 | |
Number of CLBs | 4300 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Organization | 4300 CLBS | |
Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
Supply Voltage-Max | 940 mV | |
Supply Voltage-Min | 860 mV | |
JESD-30 Code | S-PBGA-B1152 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | FBGA-1152 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EP3SL110F1152I4G Datasheet Download
EP3SL110F1152I4G Overview
The chip model EP3SL110F1152I4G is a semiconductor device that is widely used in many industries today. It is a versatile chip that is capable of being used in a variety of applications, from networking to robotics. As such, it is important to consider the industry trends of the chip model and the potential future applications that it may be used in.
In terms of industry trends, the chip model EP3SL110F1152I4G is increasingly being used in the development of intelligent networks and systems. This is due to its ability to process large amounts of data quickly and accurately, making it ideal for machine learning and artificial intelligence applications. Furthermore, the chip model is also being used in the development of intelligent robots, which require complex algorithms and high-speed processing power.
The chip model EP3SL110F1152I4G is also being used in the development of fully intelligent systems. These systems are capable of performing complex tasks with minimal human intervention. As such, the chip model is being used in the development of autonomous vehicles, smart home systems, and other intelligent systems. Furthermore, the chip model is also being used in the development of intelligent robots, which require a great deal of technical talent to use effectively.
In terms of future development, the chip model EP3SL110F1152I4G is expected to be used in a variety of new applications. For example, it is possible that the chip model could be used in the development of autonomous drones, robotic surgery, and other applications that require complex algorithms and high-speed processing power. Furthermore, the chip model could also be used in the development of intelligent robots, which require a great deal of technical talent to use effectively.
Overall, the chip model EP3SL110F1152I4G is a versatile chip that is capable of being used in a variety of applications. As such, it is important to consider the industry trends of the chip model and the potential future applications that it may be used in. Furthermore, the chip model is also being used in the development of intelligent robots, which require a great deal of technical talent to use effectively. With the right technical talent and advanced algorithms, the chip model EP3SL110F1152I4G could be used to develop and popularize future intelligent robots and systems.
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1,529 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $8,971.5450 | $8,971.5450 |
10+ | $8,875.0768 | $88,750.7679 |
100+ | $8,392.7357 | $839,273.5662 |
1000+ | $7,910.3945 | $3,955,197.2660 |
10000+ | $7,235.1170 | $7,235,116.9500 |
The price is for reference only, please refer to the actual quotation! |