
Intel Corporation
EP3SL110F1152C4LN
EP3SL110F1152C4LN ECAD Model
EP3SL110F1152C4LN Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 744 | |
Number of Outputs | 744 | |
Number of Logic Cells | 107500 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
Clock Frequency-Max | 717 MHz | |
Power Supplies | 1.2/3.3 V | |
Supply Voltage-Max | 940 mV | |
Supply Voltage-Min | 860 mV | |
JESD-30 Code | S-PBGA-B1152 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.9 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | LEAD FREE, FBGA-1152 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EP3SL110F1152C4LN Datasheet Download
EP3SL110F1152C4LN Overview
The chip model EP3SL110F1152C4LN is an advanced semiconductor device that is designed to meet the needs of various industries. It is a multi-functional chip that is capable of providing a wide range of services, from basic data processing to complex communication systems. The chip has been designed to be compatible with various operating systems and platforms, making it an ideal choice for many applications.
The main advantages of the EP3SL110F1152C4LN chip model are its high performance, low power consumption, and long-term reliability. The chip is capable of delivering high-speed data processing, and its low power consumption means that it is more energy efficient than many other models. Additionally, the chip is designed to be highly reliable, meaning it is unlikely to fail or become damaged in the long term.
The expected demand for the EP3SL110F1152C4LN chip model is likely to increase in the future. With the increasing complexity of communication systems, the need for reliable and efficient semiconductor devices is likely to grow. Furthermore, the chip's compatibility with a wide range of platforms and operating systems makes it a suitable choice for many applications.
The original design intention behind the EP3SL110F1152C4LN chip model was to create a device that would be capable of meeting the needs of various industries. The chip is designed to be capable of providing high-speed data processing, while also being energy efficient and reliable. Furthermore, the chip is designed to be compatible with a wide range of platforms and operating systems, making it a suitable choice for many applications.
It is possible that the EP3SL110F1152C4LN chip model may be upgraded in the future. As technology advances, the need for more efficient and reliable semiconductor devices will likely increase. Therefore, it is likely that the chip may be upgraded in order to meet the demands of the latest communication systems.
The product description and specific design requirements of the EP3SL110F1152C4LN chip model are as follows. The chip is designed to be capable of providing high-speed data processing, while also being energy efficient and reliable. Additionally, the chip is designed to be compatible with a wide range of platforms and operating systems, making it a suitable choice for many applications.
In order to ensure the correct implementation of the EP3SL110F1152C4LN chip model, it is important to adhere to the design requirements. Furthermore, it is important to ensure that the chip is compatible with the intended operating system and platform. Additionally, it is important to ensure that the chip is properly mounted and connected in order to ensure its optimal performance.
To conclude, the EP3SL110F1152C4LN chip model is an advanced semiconductor device that is designed to meet the needs of various industries. The chip has been designed to provide high-speed data processing, while also being energy efficient and reliable. Additionally, the chip is designed to be compatible with a wide range of platforms and operating systems, making it a suitable choice for many applications. Furthermore, it is possible that the chip may be upgraded in the future in order to meet the demands of the latest communication systems. Therefore, it is important to adhere to the design requirements and ensure that the chip is properly mounted and connected in order to ensure its optimal performance.
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4,130 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $1,749.3317 | $1,749.3317 |
10+ | $1,730.5217 | $17,305.2166 |
100+ | $1,636.4716 | $163,647.1566 |
1000+ | $1,542.4215 | $771,210.7380 |
10000+ | $1,410.7514 | $1,410,751.3500 |
The price is for reference only, please refer to the actual quotation! |