EP3SL110F1152C4LN
EP3SL110F1152C4LN
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

EP3SL110F1152C4LN


EP3SL110F1152C4LN
F18-EP3SL110F1152C4LN
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, LEAD FREE, FBGA-1152
LEAD FREE, FBGA-1152

EP3SL110F1152C4LN ECAD Model


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EP3SL110F1152C4LN Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 900 mV
Number of Inputs 744
Number of Outputs 744
Number of Logic Cells 107500
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Additional Feature IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Clock Frequency-Max 717 MHz
Power Supplies 1.2/3.3 V
Supply Voltage-Max 940 mV
Supply Voltage-Min 860 mV
JESD-30 Code S-PBGA-B1152
Qualification Status Not Qualified
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1152
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1152,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.9 mm
Ihs Manufacturer INTEL CORP
Package Description LEAD FREE, FBGA-1152
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP3SL110F1152C4LN Datasheet Download


EP3SL110F1152C4LN Overview



The chip model EP3SL110F1152C4LN is an advanced semiconductor device that is designed to meet the needs of various industries. It is a multi-functional chip that is capable of providing a wide range of services, from basic data processing to complex communication systems. The chip has been designed to be compatible with various operating systems and platforms, making it an ideal choice for many applications.


The main advantages of the EP3SL110F1152C4LN chip model are its high performance, low power consumption, and long-term reliability. The chip is capable of delivering high-speed data processing, and its low power consumption means that it is more energy efficient than many other models. Additionally, the chip is designed to be highly reliable, meaning it is unlikely to fail or become damaged in the long term.


The expected demand for the EP3SL110F1152C4LN chip model is likely to increase in the future. With the increasing complexity of communication systems, the need for reliable and efficient semiconductor devices is likely to grow. Furthermore, the chip's compatibility with a wide range of platforms and operating systems makes it a suitable choice for many applications.


The original design intention behind the EP3SL110F1152C4LN chip model was to create a device that would be capable of meeting the needs of various industries. The chip is designed to be capable of providing high-speed data processing, while also being energy efficient and reliable. Furthermore, the chip is designed to be compatible with a wide range of platforms and operating systems, making it a suitable choice for many applications.


It is possible that the EP3SL110F1152C4LN chip model may be upgraded in the future. As technology advances, the need for more efficient and reliable semiconductor devices will likely increase. Therefore, it is likely that the chip may be upgraded in order to meet the demands of the latest communication systems.


The product description and specific design requirements of the EP3SL110F1152C4LN chip model are as follows. The chip is designed to be capable of providing high-speed data processing, while also being energy efficient and reliable. Additionally, the chip is designed to be compatible with a wide range of platforms and operating systems, making it a suitable choice for many applications.


In order to ensure the correct implementation of the EP3SL110F1152C4LN chip model, it is important to adhere to the design requirements. Furthermore, it is important to ensure that the chip is compatible with the intended operating system and platform. Additionally, it is important to ensure that the chip is properly mounted and connected in order to ensure its optimal performance.


To conclude, the EP3SL110F1152C4LN chip model is an advanced semiconductor device that is designed to meet the needs of various industries. The chip has been designed to provide high-speed data processing, while also being energy efficient and reliable. Additionally, the chip is designed to be compatible with a wide range of platforms and operating systems, making it a suitable choice for many applications. Furthermore, it is possible that the chip may be upgraded in the future in order to meet the demands of the latest communication systems. Therefore, it is important to adhere to the design requirements and ensure that the chip is properly mounted and connected in order to ensure its optimal performance.



4,130 In Stock


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Unit Price: $1,881.0018
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,749.3317 $1,749.3317
10+ $1,730.5217 $17,305.2166
100+ $1,636.4716 $163,647.1566
1000+ $1,542.4215 $771,210.7380
10000+ $1,410.7514 $1,410,751.3500
The price is for reference only, please refer to the actual quotation!

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