EP3SL110F1152C4L
EP3SL110F1152C4L
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rohs

Intel Corporation

EP3SL110F1152C4L


EP3SL110F1152C4L
F18-EP3SL110F1152C4L
Active
FIELD PROGRAMMABLE GATE ARRAY, FBGA-1152
FBGA-1152

EP3SL110F1152C4L ECAD Model


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EP3SL110F1152C4L Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 900 mV
Number of Inputs 744
Number of Outputs 744
Number of Logic Cells 107500
Number of CLBs 4300
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Organization 4300 CLBS
Additional Feature IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Power Supplies 1.2/3.3 V
Supply Voltage-Max 940 mV
Supply Voltage-Min 860 mV
JESD-30 Code S-PBGA-B1152
Qualification Status Not Qualified
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1152
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1152,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer INTEL CORP
Package Description FBGA-1152
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP3SL110F1152C4L Datasheet Download


EP3SL110F1152C4L Overview



The chip model EP3SL110F1152C4L is a high-performance and low-power field-programmable gate array (FPGA) device developed by Altera Corporation. It is a device that provides a flexible, low-cost platform for system-on-a-chip (SoC) development. As a result, it has become an important part of the industry's development and has been widely used in many areas.


In terms of industry trends, the chip model EP3SL110F1152C4L is expected to continue to be widely used in the future, as it provides a cost-effective solution for system-on-a-chip (SoC) development. In addition, this chip model is expected to be used in more and more applications, such as networks, intelligent scenarios, and even in the era of fully intelligent systems.


In terms of the application environment, the chip model EP3SL110F1152C4L is expected to require the support of new technologies in order to be used effectively. For example, it may need to be integrated with other systems, such as artificial intelligence (AI) and machine learning (ML), in order to be used in more advanced applications.


In terms of the possible applications of the chip model EP3SL110F1152C4L in networks and intelligent scenarios, it is expected that it will be used in the development and popularization of future intelligent robots. This is because the chip model provides a low-cost and flexible platform for SoC development, which is suitable for the development of robots.


Finally, in terms of the technical talents needed to use the chip model EP3SL110F1152C4L effectively, it is expected that engineers with knowledge in the areas of system-on-a-chip (SoC) development, artificial intelligence (AI), and machine learning (ML) will be needed. This is because the chip model requires the support of new technologies in order to be used effectively.


In conclusion, the chip model EP3SL110F1152C4L is expected to be widely used in the future due to its cost-effectiveness and flexibility. It is expected to be used in networks, intelligent scenarios, and even in the era of fully intelligent systems. In addition, it is expected to be used in the development and popularization of future intelligent robots. Finally, it is expected that engineers with knowledge in the areas of system-on-a-chip (SoC) development, artificial intelligence (AI), and machine learning (ML) will be needed in order to use the chip model effectively.



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Unit Price: $2,069.1019
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,924.2648 $1,924.2648
10+ $1,903.5737 $19,035.7375
100+ $1,800.1187 $180,011.8653
1000+ $1,696.6636 $848,331.7790
10000+ $1,551.8264 $1,551,826.4250
The price is for reference only, please refer to the actual quotation!

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