
Intel Corporation
EP3SL110F1152C4L
EP3SL110F1152C4L ECAD Model
EP3SL110F1152C4L Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 744 | |
Number of Outputs | 744 | |
Number of Logic Cells | 107500 | |
Number of CLBs | 4300 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Organization | 4300 CLBS | |
Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
Power Supplies | 1.2/3.3 V | |
Supply Voltage-Max | 940 mV | |
Supply Voltage-Min | 860 mV | |
JESD-30 Code | S-PBGA-B1152 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | FBGA-1152 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EP3SL110F1152C4L Datasheet Download
EP3SL110F1152C4L Overview
The chip model EP3SL110F1152C4L is a high-performance and low-power field-programmable gate array (FPGA) device developed by Altera Corporation. It is a device that provides a flexible, low-cost platform for system-on-a-chip (SoC) development. As a result, it has become an important part of the industry's development and has been widely used in many areas.
In terms of industry trends, the chip model EP3SL110F1152C4L is expected to continue to be widely used in the future, as it provides a cost-effective solution for system-on-a-chip (SoC) development. In addition, this chip model is expected to be used in more and more applications, such as networks, intelligent scenarios, and even in the era of fully intelligent systems.
In terms of the application environment, the chip model EP3SL110F1152C4L is expected to require the support of new technologies in order to be used effectively. For example, it may need to be integrated with other systems, such as artificial intelligence (AI) and machine learning (ML), in order to be used in more advanced applications.
In terms of the possible applications of the chip model EP3SL110F1152C4L in networks and intelligent scenarios, it is expected that it will be used in the development and popularization of future intelligent robots. This is because the chip model provides a low-cost and flexible platform for SoC development, which is suitable for the development of robots.
Finally, in terms of the technical talents needed to use the chip model EP3SL110F1152C4L effectively, it is expected that engineers with knowledge in the areas of system-on-a-chip (SoC) development, artificial intelligence (AI), and machine learning (ML) will be needed. This is because the chip model requires the support of new technologies in order to be used effectively.
In conclusion, the chip model EP3SL110F1152C4L is expected to be widely used in the future due to its cost-effectiveness and flexibility. It is expected to be used in networks, intelligent scenarios, and even in the era of fully intelligent systems. In addition, it is expected to be used in the development and popularization of future intelligent robots. Finally, it is expected that engineers with knowledge in the areas of system-on-a-chip (SoC) development, artificial intelligence (AI), and machine learning (ML) will be needed in order to use the chip model effectively.
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5,523 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $1,924.2648 | $1,924.2648 |
10+ | $1,903.5737 | $19,035.7375 |
100+ | $1,800.1187 | $180,011.8653 |
1000+ | $1,696.6636 | $848,331.7790 |
10000+ | $1,551.8264 | $1,551,826.4250 |
The price is for reference only, please refer to the actual quotation! |