Intel Corporation
EP3SL110F1152C4
EP3SL110F1152C4 ECAD Model
EP3SL110F1152C4 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 744 | |
| Number of Outputs | 744 | |
| Number of Logic Cells | 107500 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Clock Frequency-Max | 717 MHz | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.9 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL110F1152C4 Datasheet Download
EP3SL110F1152C4 Overview
The chip model EP3SL110F1152C4 is a powerful, high-performance device that is suitable for a variety of digital signal processing, embedded processing, and image processing applications. It is designed to be used with the HDL language, which is a high-level language that is used for design, verification, and synthesis of digital circuits. This chip model offers a number of advantages that make it an attractive choice for use in a variety of industries.
The EP3SL110F1152C4 has a number of features that make it ideal for high-performance digital signal processing, embedded processing, and image processing applications. It has a high-speed processor, a large memory capacity, and a low-power consumption, which make it an ideal choice for these types of applications. Additionally, it has a number of features that make it easier to use, such as a flexible instruction set and a wide range of peripherals.
The EP3SL110F1152C4 is also capable of being used in networks and is expected to be increasingly used in intelligent scenarios in the future. This chip model is capable of being used in a variety of intelligent scenarios, such as for machine learning, natural language processing, and computer vision. Additionally, it is expected to be increasingly used in the era of fully intelligent systems, as it is capable of being used in a variety of scenarios, including autonomous vehicles, smart homes, and robotics.
The EP3SL110F1152C4 is a powerful chip model that is capable of being used in a variety of applications. Its high-performance processor, large memory capacity, and low-power consumption make it an ideal choice for digital signal processing, embedded processing, and image processing applications. Additionally, its ability to be used in networks and intelligent scenarios make it an attractive choice for use in the era of fully intelligent systems. As the demand for intelligent systems continues to increase, the EP3SL110F1152C4 is likely to become an increasingly popular choice for use in a variety of applications.
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5,797 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,282.8481 | $1,282.8481 |
| 10+ | $1,269.0541 | $12,690.5407 |
| 100+ | $1,200.0837 | $120,008.3742 |
| 1000+ | $1,131.1134 | $565,556.7060 |
| 10000+ | $1,034.5550 | $1,034,554.9500 |
| The price is for reference only, please refer to the actual quotation! | ||