EP3SL110F1152C3G
EP3SL110F1152C3G
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rohs

Intel Corporation

EP3SL110F1152C3G


EP3SL110F1152C3G
F18-EP3SL110F1152C3G
Active
FIELD PROGRAMMABLE GATE ARRAY, FBGA-1152
FBGA-1152

EP3SL110F1152C3G ECAD Model


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EP3SL110F1152C3G Attributes


Type Description Select
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 744
Number of Outputs 744
Number of Logic Cells 107500
Number of CLBs 4300
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Organization 4300 CLBS
Additional Feature IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Supply Voltage-Max 940 mV
Supply Voltage-Min 860 mV
JESD-30 Code S-PBGA-B1152
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1152
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1152,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer INTEL CORP
Package Description FBGA-1152
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP3SL110F1152C3G Datasheet Download


EP3SL110F1152C3G Overview



The chip model EP3SL110F1152C3G is a highly advanced integrated circuit that is capable of being used in a variety of networked applications. It is specifically designed to support the development and popularization of future intelligent systems and robots. This chip model is a powerful tool for engineers and developers to create intelligent systems that can perform complex tasks with minimal energy consumption.


The EP3SL110F1152C3G is a highly efficient, low-power chip model designed to support the development of intelligent networks and robots. It is designed to enable the creation of complex and intelligent systems with minimal energy consumption. This chip model is capable of supporting a wide range of applications, from high-end industrial applications to consumer electronics. It is also capable of supporting the development of future intelligent robots.


The product description and specific design requirements of the chip model EP3SL110F1152C3G are detailed in the official product documentation. This documentation outlines the features and capabilities of the chip model, as well as the technical specifications and design requirements. The documentation also includes detailed instructions on how to use the chip model effectively, as well as actual case studies of successful implementations.


The EP3SL110F1152C3G can be used in the era of fully intelligent systems, as it is designed to support the development and popularization of future intelligent robots. This chip model is capable of supporting a wide range of applications, from industrial applications to consumer electronics. In order to use the model effectively, technical talents such as software engineers, hardware engineers, and roboticists are needed to design and develop intelligent systems that can effectively utilize the chip model.


In conclusion, the chip model EP3SL110F1152C3G is a powerful tool for engineers and developers to create intelligent systems that can perform complex tasks with minimal energy consumption. It is capable of supporting a wide range of applications, from high-end industrial applications to consumer electronics. It is also capable of supporting the development of future intelligent robots. In order to use the model effectively, technical talents such as software engineers, hardware engineers, and roboticists are needed to design and develop intelligent systems that can effectively utilize the chip model.



1,909 In Stock


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Unit Price: $11,093.6913
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Pricing (USD)

QTY Unit Price Ext Price
1+ $10,317.1329 $10,317.1329
10+ $10,206.1960 $102,061.9600
100+ $9,651.5114 $965,151.1431
1000+ $9,096.8269 $4,548,413.4330
10000+ $8,320.2685 $8,320,268.4750
The price is for reference only, please refer to the actual quotation!

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