Intel Corporation
EP3SL110F1152C2G
EP3SL110F1152C2G ECAD Model
EP3SL110F1152C2G Attributes
| Type | Description | Select |
|---|---|---|
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 744 | |
| Number of Outputs | 744 | |
| Number of Logic Cells | 107500 | |
| Number of CLBs | 4300 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 4300 CLBS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL110F1152C2G Datasheet Download
EP3SL110F1152C2G Overview
The EP3SL110F1152C2G chip model is an advanced integrated circuit designed for high-performance digital signal processing, embedded processing, and image processing. It is a powerful tool for applications such as data acquisition, communications, and multimedia. The model is designed to be used with HDL (Hardware Description Language) and offers a range of features and benefits.
The EP3SL110F1152C2G chip model provides excellent performance in a wide range of applications. The model is optimized for high-speed data processing and offers advanced features such as low power consumption, high integration, and high-speed operation. It also features advanced security features such as encryption and authentication.
The EP3SL110F1152C2G chip model is designed to be used in a variety of industries, including automotive, aerospace, and medical. It is also suitable for industrial applications such as machine vision, robotics, and automation. The model is designed to be highly compatible with existing systems, making it an ideal choice for system upgrades.
The EP3SL110F1152C2G chip model is easy to design and integrate into existing systems. The model is designed with an integrated development environment that enables users to quickly and easily create and debug their applications. In addition, the model supports a variety of programming languages, including C and C++, making it a versatile solution for a wide range of applications.
The EP3SL110F1152C2G chip model is designed for reliability and performance. It is designed to be resistant to environmental conditions such as temperature and humidity, and it is also designed to be resilient against power surges, making it an ideal choice for industrial applications.
The EP3SL110F1152C2G chip model is expected to see increasing demand in the future, as more industries and applications rely on advanced integrated circuits for their operations. The model is designed for high-performance digital signal processing, embedded processing, and image processing, making it an ideal choice for a wide range of applications.
When designing with the EP3SL110F1152C2G chip model, it is important to consider the specific design requirements of the application. The model is designed to be used with HDL, so it is important to ensure that the code is written correctly and that all necessary components are included. It is also important to consider the power consumption of the model, as this can affect the performance and reliability of the application.
When using the EP3SL110F1152C2G chip model, it is important to consider actual case studies and precautions. The model is designed for reliability and performance, but it is important to ensure that all components are correctly integrated into the system. It is also important to consider the environmental conditions in which the chip will be used, as this can affect its performance.
The EP3SL110F1152C2G chip model is an advanced integrated circuit designed for high-performance digital signal processing, embedded processing, and image processing. It offers a range of features and benefits, including low power consumption, high integration, and high-speed operation. The model is designed to be used with HDL and is expected to see increasing demand in the future. When designing with the EP3SL110F1152C2G chip model, it is important to consider the specific design requirements of the application and to consider actual case studies and precautions.
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5,717 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $12,903.1752 | $12,903.1752 |
| 10+ | $12,764.4313 | $127,644.3135 |
| 100+ | $12,070.7123 | $1,207,071.2253 |
| 1000+ | $11,376.9932 | $5,688,496.5790 |
| 10000+ | $10,405.7864 | $10,405,786.4250 |
| The price is for reference only, please refer to the actual quotation! | ||