
Intel Corporation
EP3SE80F780I4G
EP3SE80F780I4G ECAD Model
EP3SE80F780I4G Attributes
Type | Description | Select |
---|---|---|
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 488 | |
Number of Outputs | 488 | |
Number of Logic Cells | 80000 | |
Number of CLBs | 3200 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Organization | 3200 CLBS | |
Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
Supply Voltage-Max | 940 mV | |
Supply Voltage-Min | 860 mV | |
JESD-30 Code | S-PBGA-B780 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 780 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA780,28X28,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 29 mm | |
Length | 29 mm | |
Seated Height-Max | 3 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | FBGA-780 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EP3SE80F780I4G Datasheet Download
EP3SE80F780I4G Overview
The EP3SE80F780I4G chip model is a powerful and versatile model designed for high-performance digital signal processing, embedded processing, image processing, and other applications. It is built with a Hardened Lockstep ARM Cortex-A9 dual-core processor and an FPGA logic fabric, making it capable of running complex algorithms quickly and accurately. The chip model is designed to be programmed using HDL (Hardware Description Language), a language designed to simplify the process of creating and maintaining hardware designs.
The EP3SE80F780I4G chip model offers a wealth of features and capabilities, allowing users to create powerful designs for a wide range of applications. It includes a wide variety of memory configurations, allowing for both high-speed and low-power operation. Additionally, it supports a wide range of peripherals, including Ethernet, USB, and I2C, making it well-suited for a variety of embedded applications.
When using the EP3SE80F780I4G chip model, there are several important considerations to keep in mind. The chip model is designed for high-performance applications, so it is important to ensure that the design is optimized for the application at hand. Additionally, it is important to ensure that the design is robust and reliable, as any errors could lead to unexpected results. Finally, it is important to ensure that the design is well-documented, as this will make it easier to maintain and debug in the future.
The EP3SE80F780I4G chip model is a powerful and versatile model that can be used to create a wide range of applications. It is well-suited for the development and popularization of future intelligent robots, as it is capable of running complex algorithms quickly and accurately. To use the model effectively, it is important to have a strong understanding of HDL and embedded systems design. Additionally, an understanding of system optimization and debugging techniques is also beneficial, as these will help to ensure that the design is robust and reliable.
You May Also Be Interested In
1,468 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $2,896.0051 | $2,896.0051 |
10+ | $2,864.8653 | $28,648.6528 |
100+ | $2,709.1661 | $270,916.6080 |
1000+ | $2,553.4669 | $1,276,733.4400 |
10000+ | $2,335.4880 | $2,335,488.0000 |
The price is for reference only, please refer to the actual quotation! |