EP3SE80F780I4G
EP3SE80F780I4G
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rohs

Intel Corporation

EP3SE80F780I4G


EP3SE80F780I4G
F18-EP3SE80F780I4G
Active
FIELD PROGRAMMABLE GATE ARRAY, FBGA-780
FBGA-780

EP3SE80F780I4G ECAD Model


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EP3SE80F780I4G Attributes


Type Description Select
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 488
Number of Outputs 488
Number of Logic Cells 80000
Number of CLBs 3200
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Organization 3200 CLBS
Additional Feature IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Supply Voltage-Max 940 mV
Supply Voltage-Min 860 mV
JESD-30 Code S-PBGA-B780
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 780
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA780,28X28,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 29 mm
Length 29 mm
Seated Height-Max 3 mm
Ihs Manufacturer INTEL CORP
Package Description FBGA-780
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP3SE80F780I4G Datasheet Download


EP3SE80F780I4G Overview



The EP3SE80F780I4G chip model is a powerful and versatile model designed for high-performance digital signal processing, embedded processing, image processing, and other applications. It is built with a Hardened Lockstep ARM Cortex-A9 dual-core processor and an FPGA logic fabric, making it capable of running complex algorithms quickly and accurately. The chip model is designed to be programmed using HDL (Hardware Description Language), a language designed to simplify the process of creating and maintaining hardware designs.


The EP3SE80F780I4G chip model offers a wealth of features and capabilities, allowing users to create powerful designs for a wide range of applications. It includes a wide variety of memory configurations, allowing for both high-speed and low-power operation. Additionally, it supports a wide range of peripherals, including Ethernet, USB, and I2C, making it well-suited for a variety of embedded applications.


When using the EP3SE80F780I4G chip model, there are several important considerations to keep in mind. The chip model is designed for high-performance applications, so it is important to ensure that the design is optimized for the application at hand. Additionally, it is important to ensure that the design is robust and reliable, as any errors could lead to unexpected results. Finally, it is important to ensure that the design is well-documented, as this will make it easier to maintain and debug in the future.


The EP3SE80F780I4G chip model is a powerful and versatile model that can be used to create a wide range of applications. It is well-suited for the development and popularization of future intelligent robots, as it is capable of running complex algorithms quickly and accurately. To use the model effectively, it is important to have a strong understanding of HDL and embedded systems design. Additionally, an understanding of system optimization and debugging techniques is also beneficial, as these will help to ensure that the design is robust and reliable.



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Unit Price: $3,113.984
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Pricing (USD)

QTY Unit Price Ext Price
1+ $2,896.0051 $2,896.0051
10+ $2,864.8653 $28,648.6528
100+ $2,709.1661 $270,916.6080
1000+ $2,553.4669 $1,276,733.4400
10000+ $2,335.4880 $2,335,488.0000
The price is for reference only, please refer to the actual quotation!

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