Intel Corporation
EP3SE80F780C3
EP3SE80F780C3 ECAD Model
EP3SE80F780C3 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 488 | |
| Number of Outputs | 488 | |
| Number of Logic Cells | 80000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Clock Frequency-Max | 717 MHz | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-780 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SE80F780C3 Datasheet Download
EP3SE80F780C3 Overview
The chip model EP3SE80F780C3 is a cutting-edge product from Altera, a leading provider of programmable logic solutions. It is a high-performance, low-power, field-programmable gate array (FPGA) device that is designed to meet the needs of today’s advanced communication systems. This chip model is ideal for applications requiring high-speed data processing and high-speed communication, such as advanced communication systems.
The EP3SE80F780C3 is a highly integrated device that integrates a variety of features, such as high-speed transceivers, high-speed SERDES, and high-density memory. It is designed to provide a high performance, low power, and cost-effective solution for a wide range of applications. It also offers a wide range of configurability options, allowing users to customize the device to their specific needs.
The EP3SE80F780C3 is designed to be easily upgradable and expandable. It is designed to support a wide range of applications and can be used for a variety of applications, such as wireless communication, video processing, and image processing. The device also supports a wide range of peripherals, such as Ethernet, USB, and I2C, allowing for easy integration into existing systems.
The EP3SE80F780C3 is a powerful device that can be used to develop and popularize future intelligent robots. It is an ideal choice for embedded systems, as it offers a wide range of features that can help to improve the performance of the robots. To use the model effectively, technical talents such as embedded software engineers, hardware engineers, and system architects are needed.
In conclusion, the chip model EP3SE80F780C3 is a powerful and versatile device that can be used to meet the needs of today’s advanced communication systems. It is designed to be upgradable and expandable, and can be used to develop and popularize future intelligent robots. To use the model effectively, technical talents such as embedded software engineers, hardware engineers, and system architects are needed.
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1,698 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,769.7911 | $1,769.7911 |
| 10+ | $1,750.7611 | $17,507.6110 |
| 100+ | $1,655.6110 | $165,561.1044 |
| 1000+ | $1,560.4610 | $780,230.4920 |
| 10000+ | $1,427.2509 | $1,427,250.9000 |
| The price is for reference only, please refer to the actual quotation! | ||