Intel Corporation
EP3SE80F780C2N
EP3SE80F780C2N ECAD Model
EP3SE80F780C2N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 488 | |
| Number of Outputs | 488 | |
| Number of Logic Cells | 80000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Clock Frequency-Max | 800 MHz | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA780,28X28,40 | |
| Pin Count | 780 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
EP3SE80F780C2N Overview
The chip model EP3SE80F780C2N is a powerful and versatile integrated circuit (IC) developed by Altera Corporation. It is designed for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. The chip model EP3SE80F780C2N is a powerful and reliable processor with a wide range of features, including high-speed processing, low power consumption, and a high level of integration.
The original design intention of the chip model EP3SE80F780C2N was to provide a powerful and reliable processing solution for a variety of applications. The chip model EP3SE80F780C2N is capable of performing a variety of tasks, from basic arithmetic operations to more advanced signal processing algorithms. The chip model EP3SE80F780C2N is also designed to be easily upgradable, allowing users to add additional features and capabilities as needed.
The chip model EP3SE80F780C2N is also suitable for use in advanced communication systems. It can be used to develop high-speed networks and to provide reliable and secure data transmission. The chip model EP3SE80F780C2N is also capable of handling complex algorithms and data structures, making it suitable for use in intelligent systems. In addition, the chip model EP3SE80F780C2N is capable of handling large amounts of data, making it ideal for use in the era of fully intelligent systems.
In conclusion, the chip model EP3SE80F780C2N is an advanced and reliable integrated circuit that is suitable for a variety of applications. It is capable of providing high-speed processing, low power consumption, and a high level of integration. It is also capable of handling complex algorithms and data structures, making it suitable for use in advanced communication systems and intelligent systems. The chip model EP3SE80F780C2N is also designed to be easily upgradable, making it ideal for use in the era of fully intelligent systems.
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4,853 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,091.5822 | $2,091.5822 |
| 10+ | $2,069.0921 | $20,690.9205 |
| 100+ | $1,956.6414 | $195,664.1397 |
| 1000+ | $1,844.1907 | $922,095.3710 |
| 10000+ | $1,686.7598 | $1,686,759.8250 |
| The price is for reference only, please refer to the actual quotation! | ||