Intel Corporation
EP3SE80F780C2G
EP3SE80F780C2G ECAD Model
EP3SE80F780C2G Attributes
| Type | Description | Select |
|---|---|---|
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 488 | |
| Number of Outputs | 488 | |
| Number of Logic Cells | 80000 | |
| Number of CLBs | 3200 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 3200 CLBS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-780 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SE80F780C2G Datasheet Download
EP3SE80F780C2G Overview
The chip model EP3SE80F780C2G is a FPGA (Field Programmable Gate Array) chip from the company Altera. It is a high-performance, low-power device that is used primarily in embedded systems and networks. This chip model is designed to provide the best performance and power efficiency for a variety of applications, including communications, multimedia, military, aerospace, and industrial automation applications.
The EP3SE80F780C2G chip model has several advantages over other FPGA chips. It has a wide range of features, including a high system clock speed, low-power consumption, and a small form factor. It also offers a high degree of flexibility and scalability, allowing it to be used in a variety of applications. Furthermore, it has a wide variety of I/O options, including Ethernet, USB, and serial interfaces.
The chip model EP3SE80F780C2G is expected to be in high demand in the future, especially in the area of embedded systems. This is due to the fact that many applications require high-performance, low-power chips, and the EP3SE80F780C2G is an ideal choice for such applications. In addition, the chip model is expected to be used in many intelligent scenarios, such as autonomous vehicles and smart home systems.
In terms of its future applications, the EP3SE80F780C2G chip model is expected to be used in networks, such as 5G and Wi-Fi networks. It is also expected to be used in the era of fully intelligent systems, such as the Internet of Things (IoT). The chip model is expected to provide the necessary performance and power efficiency to support the new technologies needed for these applications.
The EP3SE80F780C2G chip model is a powerful and efficient device that is expected to be in high demand in the future. Its wide range of features and I/O options make it an ideal choice for a variety of applications, including embedded systems, networks, and intelligent systems. It is expected to be used in the era of fully intelligent systems, providing the necessary performance and power efficiency to support the new technologies needed for these applications.
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2,571 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $3,764.8186 | $3,764.8186 |
| 10+ | $3,724.3366 | $37,243.3664 |
| 100+ | $3,521.9270 | $352,192.7040 |
| 1000+ | $3,319.5174 | $1,659,758.7200 |
| 10000+ | $3,036.1440 | $3,036,144.0000 |
| The price is for reference only, please refer to the actual quotation! | ||