Intel Corporation
EP3SE80F1152C4L
EP3SE80F1152C4L ECAD Model
EP3SE80F1152C4L Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 744 | |
| Number of Outputs | 744 | |
| Number of Logic Cells | 80000 | |
| Number of CLBs | 3200 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 3200 CLBS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SE80F1152C4L Datasheet Download
EP3SE80F1152C4L Overview
The chip model EP3SE80F1152C4L is a cutting-edge technology in the semiconductor industry. It is designed to provide high performance, reliability, and scalability for various applications. It is the latest development in the field of integrated circuit (IC) design, and it is widely used in communication systems, robotics, and other advanced technologies.
The chip model EP3SE80F1152C4L is designed to be future-proof and upgradeable. This means that it can be upgraded to support new technologies and applications as they become available. This makes it ideal for applications that require the latest technology, such as advanced communication systems, intelligent robots, and other advanced technologies.
The chip model EP3SE80F1152C4L is also designed to be user-friendly and easy to use. It is designed to be compatible with a wide range of systems and applications, making it a great choice for developers and engineers. It is also designed to be highly efficient, allowing for maximum performance and reliability.
As the chip model EP3SE80F1152C4L is designed for advanced technologies, it requires a certain level of expertise to use it effectively. Engineers and developers need to be familiar with the technology and understand the various aspects of the chip model. This includes understanding the design intent, the features, and how to program and debug the chip model.
The chip model EP3SE80F1152C4L is a great choice for those looking to develop or use advanced technologies. It is designed to be future-proof and upgradeable, making it ideal for applications that require the latest technology. It is also user-friendly and easy to use, allowing for maximum performance and reliability. With the right technical expertise, the chip model EP3SE80F1152C4L can be used to develop and popularize future intelligent robots and other advanced technologies.
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2,667 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,119.6718 | $2,119.6718 |
| 10+ | $2,096.8796 | $20,968.7964 |
| 100+ | $1,982.9188 | $198,291.8790 |
| 1000+ | $1,868.9579 | $934,478.9700 |
| 10000+ | $1,709.4128 | $1,709,412.7500 |
| The price is for reference only, please refer to the actual quotation! | ||