Intel Corporation
EP3SE80F1152C4
EP3SE80F1152C4 ECAD Model
EP3SE80F1152C4 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 744 | |
| Number of Outputs | 744 | |
| Number of Logic Cells | 80000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Clock Frequency-Max | 717 MHz | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.9 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SE80F1152C4 Datasheet Download
EP3SE80F1152C4 Overview
The chip model EP3SE80F1152C4 is designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing. It is a highly versatile chip which is programmed using the HDL language. This model is highly reliable and offers a wide range of features that make it suitable for a variety of applications.
The EP3SE80F1152C4 chip model offers the advantage of high performance and low power consumption. It is a cost-effective solution for applications that require high-performance processing capabilities. Furthermore, it is designed to be used in a wide range of industries, including automotive, aerospace, industrial, and medical.
As the demand for high-performance digital signal processing, embedded processing, and image processing increases, the demand for the EP3SE80F1152C4 chip model is also expected to increase. The chip model is capable of performing complex tasks quickly and efficiently, making it suitable for a variety of uses.
The EP3SE80F1152C4 chip model is also expected to be used in networks and intelligent scenarios in the future. It is capable of handling large amounts of data quickly and efficiently, making it suitable for a wide range of applications. As the world moves towards a fully intelligent system, the EP3SE80F1152C4 chip model is expected to be used to power various intelligent systems.
The EP3SE80F1152C4 chip model is designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing. It offers a wide range of features that make it suitable for a variety of applications and is expected to be used in networks and intelligent scenarios in the future. As the demand for high-performance processing capabilities increases, the demand for the EP3SE80F1152C4 chip model is also expected to increase. This chip model is capable of performing complex tasks quickly and efficiently and is expected to be used to power various intelligent systems in the era of fully intelligent systems.
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1,356 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,412.7596 | $1,412.7596 |
| 10+ | $1,397.5686 | $13,975.6860 |
| 100+ | $1,321.6138 | $132,161.3781 |
| 1000+ | $1,245.6590 | $622,829.4830 |
| 10000+ | $1,139.3222 | $1,139,322.2250 |
| The price is for reference only, please refer to the actual quotation! | ||