Intel Corporation
EP3SE80F1152C3G
EP3SE80F1152C3G ECAD Model
EP3SE80F1152C3G Attributes
| Type | Description | Select |
|---|---|---|
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 744 | |
| Number of Outputs | 744 | |
| Number of Logic Cells | 80000 | |
| Number of CLBs | 3200 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 3200 CLBS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SE80F1152C3G Datasheet Download
EP3SE80F1152C3G Overview
The chip model EP3SE80F1152C3G is a highly advanced integrated circuit (IC) designed to meet the needs of modern communication systems. Developed by Altera, a leading provider of field-programmable gate array (FPGA) solutions, the EP3SE80F1152C3G is designed to be a cost-effective, high-performance solution for a variety of applications.
The EP3SE80F1152C3G is a single-chip FPGA solution that provides a powerful and flexible platform for a variety of applications. It is designed to be a highly integrated solution that offers the highest performance and cost efficiency. The device is based on a 40nm process technology and is capable of providing up to 800 million logic elements (LEs) and up to 1.5 million system logic cells (SLCs).
The EP3SE80F1152C3G is also designed to support a variety of advanced communication protocols, including Ethernet, Fibre Channel, and PCI Express. It also supports advanced features such as high-speed transceivers, multi-gigabit transceivers, and embedded memory. The device also offers a wide range of I/O and memory interfaces, making it suitable for a variety of applications.
The EP3SE80F1152C3G is also designed with the future in mind. It is capable of supporting the latest technologies, such as 5G, Wi-Fi 6, and the Internet of Things (IoT). This makes it an ideal solution for applications that require the latest technologies and require high performance.
The EP3SE80F1152C3G is also designed to be used in a variety of intelligent scenarios. It is capable of supporting advanced machine learning algorithms and can be used for autonomous driving and other intelligent applications. It is also capable of supporting the latest communication protocols, making it suitable for applications that require high-speed communication.
The EP3SE80F1152C3G is a highly advanced integrated circuit designed to meet the needs of modern communication systems. It is capable of supporting the latest technologies and is designed to be used in a variety of intelligent scenarios. It is a cost-effective, high-performance solution that is suitable for a variety of applications and can be used in the era of fully intelligent systems.
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5,156 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $9,940.6971 | $9,940.6971 |
| 10+ | $9,833.8079 | $98,338.0787 |
| 100+ | $9,299.3618 | $929,936.1792 |
| 1000+ | $8,764.9157 | $4,382,457.8560 |
| 10000+ | $8,016.6912 | $8,016,691.2000 |
| The price is for reference only, please refer to the actual quotation! | ||