Intel Corporation
EP3SE80F1152C2G
EP3SE80F1152C2G ECAD Model
EP3SE80F1152C2G Attributes
| Type | Description | Select |
|---|---|---|
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 744 | |
| Number of Outputs | 744 | |
| Number of Logic Cells | 80000 | |
| Number of CLBs | 3200 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 3200 CLBS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SE80F1152C2G Datasheet Download
EP3SE80F1152C2G Overview
The chip model EP3SE80F1152C2G is a cutting-edge technology that is designed to meet the modern demands of communication systems. It is designed to be a highly integrated solution that offers a high level of performance, reliability and scalability. It is capable of handling a wide range of applications, ranging from basic communication systems to advanced communication systems.
The EP3SE80F1152C2G chip model is designed to provide high-speed communication and data processing capabilities. It is equipped with a large number of features, such as support for multiple protocols, high-speed data transmission, and low power consumption. It also supports a variety of communication technologies, including Ethernet, Wi-Fi, Bluetooth, and Zigbee.
The chip model EP3SE80F1152C2G is designed to be highly customizable and can be easily adapted to meet the specific requirements of the customer. It is capable of supporting a wide range of applications, including advanced communication systems, industrial automation, and medical applications. The chip model is also designed to be easy to use and maintain, making it an ideal choice for designers who need a reliable and efficient solution.
When looking at the industry trends of the chip model EP3SE80F1152C2G, it is important to consider the possibility of future upgrades and the need for new technologies. The chip model is designed to be highly upgradable and can be easily adapted to meet the needs of advanced communication systems. It is also designed to be compatible with a variety of communication technologies, including Ethernet, Wi-Fi, Bluetooth, and Zigbee.
In terms of product description and specific design requirements, the chip model EP3SE80F1152C2G is designed to provide a high level of performance, reliability, and scalability. It is capable of handling a wide range of applications, including advanced communication systems, industrial automation, and medical applications. It is also designed to be easy to use and maintain, making it an ideal choice for designers who need a reliable and efficient solution.
When considering actual case studies and precautions, it is important to note that the chip model EP3SE80F1152C2G is designed to be highly customizable and can be easily adapted to meet the specific requirements of the customer. It is also designed to be compatible with a variety of communication technologies, including Ethernet, Wi-Fi, Bluetooth, and Zigbee. Furthermore, it is important to consider the possibility of future upgrades and the need for new technologies in order to ensure the chip model can be used in the most effective manner.
In conclusion, the chip model EP3SE80F1152C2G is a cutting-edge technology that is designed to meet the modern demands of communication systems. It is designed to be a highly integrated solution that offers a high level of performance, reliability and scalability. It is capable of handling a wide range of applications, ranging from basic communication systems to advanced communication systems. It is also designed to be highly customizable and can be easily adapted to meet the specific requirements of the customer. Furthermore, it is important to consider the possibility of future upgrades and the need for new technologies in order to ensure the chip model can be used in the most effective manner.
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5,287 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $12,925.6466 | $12,925.6466 |
| 10+ | $12,786.6611 | $127,866.6112 |
| 100+ | $12,091.7339 | $1,209,173.3889 |
| 1000+ | $11,396.8067 | $5,698,403.3270 |
| 10000+ | $10,423.9085 | $10,423,908.5250 |
| The price is for reference only, please refer to the actual quotation! | ||