Intel Corporation
EP3SE50F780I4LN
EP3SE50F780I4LN ECAD Model
EP3SE50F780I4LN Attributes
| Type | Description | Select |
|---|---|---|
| Mfr | Intel | |
| Series | Stratix® III E | |
| Package | Tray | |
| Number of LABs/CLBs | 1900 | |
| Number of Logic Elements/Cells | 47500 | |
| Total RAM Bits | 5760000 | |
| Number of I/O | 488 | |
| Voltage - Supply | 0.86V ~ 1.15V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 100°C (TJ) | |
| Package / Case | 780-BBGA, FCBGA | |
| Supplier Device Package | 780-FBGA (29x29) | |
| Base Product Number | EP3SE50 |
EP3SE50F780I4LN Datasheet Download
EP3SE50F780I4LN Overview
The EP3SE50F780I4LN is a Field Programmable Gate Array (FPGA) chip model from Altera Corporation. It is a member of the Cyclone III FPGA family and is designed to provide high performance and low power consumption.
The EP3SE50F780I4LN has a total of 780,000 logic elements, 4,608 Kbits of embedded memory, and 6,912 digital signal processing (DSP) blocks. It also has a total of 5,760 I/O pins and supports a maximum clock frequency of 250MHz. The device also has a total of 12 dedicated clock management tiles and up to 16 transceivers.
The EP3SE50F780I4LN is suitable for a wide range of applications, such as industrial automation, medical imaging, and communication systems. It is also ideal for applications that require high performance, low power consumption, and cost-effectiveness.
The device is available in a variety of packages, such as a 576-ball BGA, a 576-ball CSP, and a 576-ball FCBGA. It is also rated for an operating temperature range of -40°C to +85°C and a maximum junction temperature of +105°C.
Overall, the EP3SE50F780I4LN is an advanced FPGA chip model that provides high performance, low power consumption, and cost-effectiveness. It is suitable for a wide range of applications and is available in a variety of packages.
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Pricing (USD)
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