
Intel Corporation
EP3SE50F780I3G
EP3SE50F780I3G ECAD Model
EP3SE50F780I3G Attributes
Type | Description | Select |
---|---|---|
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 488 | |
Number of Outputs | 488 | |
Number of Logic Cells | 47500 | |
Number of CLBs | 1900 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Organization | 1900 CLBS | |
Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
Supply Voltage-Max | 940 mV | |
Supply Voltage-Min | 860 mV | |
JESD-30 Code | S-PBGA-B780 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Number of Terminals | 780 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA780,28X28,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 29 mm | |
Length | 29 mm | |
Seated Height-Max | 3 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | FBGA-780 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 |
EP3SE50F780I3G Datasheet Download
EP3SE50F780I3G Overview
The chip model EP3SE50F780I3G is an advanced digital signal processor suitable for a wide range of applications, including high-performance digital signal processing, embedded processing, image processing, and more. This chip model is designed to be used with HDL language, which is a hardware description language. It is used to describe the behavior of hardware, such as digital logic circuits, that is, the operations and connections of the logic gates.
The EP3SE50F780I3G chip model is a high-performance and powerful processor with a wide array of features, making it suitable for a variety of applications. It has a low power consumption rate and is designed to be compatible with multiple operating systems. It also features a wide range of memory and storage options, allowing for easy customization. Additionally, the chip model has a wide range of I/O options, allowing for a variety of input and output capabilities.
The EP3SE50F780I3G chip model is designed to be used in a variety of applications, such as high-performance digital signal processing, embedded processing, image processing, and more. Each of these applications requires different levels of support and performance, and the EP3SE50F780I3G is designed to meet these needs. For example, in digital signal processing, the chip model is designed to support a variety of algorithms and operations, such as filtering, convolution, and more. In addition, the chip model is also designed to support a variety of image processing operations, such as edge detection, color correction, and more.
The industry trends of the chip model EP3SE50F780I3G and the future development of related industries will depend on the specific technologies needed for the application environment. For example, as new technologies are developed, such as artificial intelligence and machine learning, the EP3SE50F780I3G may need to be updated to support these technologies. Additionally, as new data processing techniques are developed, such as deep learning, the EP3SE50F780I3G may need to be updated to support these techniques as well.
When designing with the EP3SE50F780I3G chip model, it is important to consider the specific design requirements of the application. For example, the chip model may need to be configured to support specific algorithms or operations, or it may need to be configured to support specific I/O options. Additionally, it is also important to consider any potential risks or limitations of the chip model, such as power consumption or heat dissipation.
Overall, the EP3SE50F780I3G is a powerful and versatile digital signal processor that is suitable for a wide range of applications. It is designed to be used with HDL language, and it features a wide range of features, such as low power consumption, multiple operating system compatibility, and a wide range of I/O options. When designing with the chip model, it is important to consider the specific design requirements of the application, as well as any potential risks or limitations of the chip model. Additionally, the industry trends of the chip model and the future development of related industries will depend on the specific technologies needed for the application environment.
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3,721 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $6,019.9906 | $6,019.9906 |
10+ | $5,955.2595 | $59,552.5954 |
100+ | $5,631.6041 | $563,160.4134 |
1000+ | $5,307.9487 | $2,653,974.3620 |
10000+ | $4,854.8312 | $4,854,831.1500 |
The price is for reference only, please refer to the actual quotation! |