Intel Corporation
EP3SE50F780C4L
EP3SE50F780C4L ECAD Model
EP3SE50F780C4L Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 488 | |
| Number of Outputs | 488 | |
| Number of Logic Cells | 47500 | |
| Number of CLBs | 1900 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 1900 CLBS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.2 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-780 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SE50F780C4L Datasheet Download
EP3SE50F780C4L Overview
The chip model EP3SE50F780C4L is a high-performance digital signal processor that is suitable for embedded processing, image processing, and other high-performance applications. It requires the use of HDL language, which is a hardware description language. It is a powerful tool for designing and verifying complex digital systems.
The chip model EP3SE50F780C4L is part of the growing trend of digital signal processing and embedded processing technology. As the demand for such technology increases, the development of new technologies will be necessary to meet the needs of the application environment. This could include technologies such as artificial intelligence, machine learning, and cloud computing.
The chip model EP3SE50F780C4L can be used in a variety of applications, such as networks, intelligent systems, and other smart scenarios. It can be used to process large amounts of data quickly and accurately, and can be used to create intelligent systems that can learn and adapt in real time. In the future, it is likely that the chip model EP3SE50F780C4L will be used in fully intelligent systems, such as self-driving cars, automated factories, and smart homes.
Overall, the chip model EP3SE50F780C4L is an important part of the growing trend of digital signal processing and embedded processing technology. It is a powerful tool for designing and verifying complex digital systems, and can be used in a variety of applications, including networks, intelligent systems, and other smart scenarios. As the demand for such technology increases, the development of new technologies will be necessary to meet the needs of the application environment. In the future, it is likely that the chip model EP3SE50F780C4L will be used in fully intelligent systems.
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4,469 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $974.9219 | $974.9219 |
| 10+ | $964.4389 | $9,644.3885 |
| 100+ | $912.0237 | $91,202.3697 |
| 1000+ | $859.6085 | $429,804.2710 |
| 10000+ | $786.2273 | $786,227.3250 |
| The price is for reference only, please refer to the actual quotation! | ||