Intel Corporation
EP3SE50F780C3
EP3SE50F780C3 ECAD Model
EP3SE50F780C3 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 488 | |
| Number of Outputs | 488 | |
| Number of Logic Cells | 47500 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Clock Frequency-Max | 717 MHz | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-780 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SE50F780C3 Datasheet Download
EP3SE50F780C3 Overview
The chip model EP3SE50F780C3 is a high performance programmable logic device (PLD) with an embedded processor core architecture. It is designed to provide the highest levels of performance and flexibility for digital signal processing, embedded processing, image processing and other applications. The EP3SE50F780C3 is programmed using the HDL language, enabling users to create custom designs quickly and efficiently.
The EP3SE50F780C3 is designed to meet the needs of today's high performance applications. Its architecture is optimized for performance, with high speed logic elements, embedded memory and DSP blocks, and a large number of I/O pins. It is designed for high speed data processing, providing up to 200 MHz of clock speed and up to 6.5Gbps of data throughput. The device also offers advanced features such as clock synchronization, dynamic power management, and programmable logic.
In terms of industry trends, the EP3SE50F780C3 is designed to provide the best performance for the most demanding applications. As technology advances and new applications emerge, the EP3SE50F780C3 is designed to be able to adapt and evolve to meet the needs of the future. The device is also designed to be upgradeable, allowing users to upgrade their designs as new technologies become available.
The original design intention of the EP3SE50F780C3 was to provide the highest levels of performance and flexibility for digital signal processing, embedded processing, image processing and other applications. The device is also well-suited for advanced communication systems, providing the necessary features and performance to support high speed data transmission. As technology advances, the EP3SE50F780C3 will continue to evolve and provide the highest levels of performance and flexibility for the most demanding applications.
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1,368 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $845.0040 | $845.0040 |
| 10+ | $835.9179 | $8,359.1789 |
| 100+ | $790.4876 | $79,048.7568 |
| 1000+ | $745.0572 | $372,528.6240 |
| 10000+ | $681.4548 | $681,454.8000 |
| The price is for reference only, please refer to the actual quotation! | ||