Intel Corporation
EP3SE50F780C2
EP3SE50F780C2 ECAD Model
EP3SE50F780C2 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 488 | |
| Number of Outputs | 488 | |
| Number of Logic Cells | 47500 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Clock Frequency-Max | 800 MHz | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA780,28X28,40 | |
| Pin Count | 780 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
EP3SE50F780C2 Overview
The chip model EP3SE50F780C2 is a powerful and versatile chip designed for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. It is a reliable and powerful choice for many applications, providing an excellent combination of features and performance.
The original design intention of the chip model EP3SE50F780C2 was to provide a reliable and powerful solution for many applications, with the possibility of future upgrades. The chip is designed to be easily upgradable, allowing for future improvements and customizations. This makes it an ideal choice for applications that require a high level of performance and flexibility.
In terms of future applications, the chip model EP3SE50F780C2 can be used in a variety of networks and intelligent scenarios. It is capable of handling complex tasks such as image processing, facial recognition, and voice recognition. It is also capable of handling sophisticated tasks such as autonomous navigation, natural language processing, and machine learning. This makes the chip model EP3SE50F780C2 a great choice for advanced communication systems and intelligent scenarios.
The chip model EP3SE50F780C2 is also well-suited for the era of fully intelligent systems. With its powerful and versatile design, it can handle complex tasks such as facial recognition, natural language processing, and machine learning. This makes it an ideal choice for advanced communication systems and intelligent scenarios.
Overall, the chip model EP3SE50F780C2 is a powerful and versatile chip that is well-suited for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. It is designed to be easily upgradable, making it an ideal choice for applications that require a high level of performance and flexibility. It is also capable of handling complex tasks such as facial recognition, natural language processing, and machine learning, making it a great choice for advanced communication systems and intelligent scenarios. This makes it an ideal choice for the era of fully intelligent systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||