Intel Corporation
EP3SE50F484C4LN
EP3SE50F484C4LN ECAD Model
EP3SE50F484C4LN Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 296 | |
| Number of Outputs | 296 | |
| Number of Logic Cells | 47500 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Clock Frequency-Max | 717 MHz | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LEAD FREE, FBGA-484 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SE50F484C4LN Datasheet Download
EP3SE50F484C4LN Overview
The chip model EP3SE50F484C4LN is an advanced integrated circuit (IC) designed for high-performance digital signal processing, embedded processing, and image processing. It is based on the Intel® Stratix® III FPGA technology, which is a high-performance, low-power FPGA technology that supports the use of the HDL (hardware description language) for programming. The chip model EP3SE50F484C4LN is designed to be highly scalable, allowing for future upgrades and expansions to be made easily.
The EP3SE50F484C4LN can be used in a variety of applications, including advanced communication systems. It can be used for high-speed data transmission, wireless communication and data security. It is also suitable for applications such as audio and video processing, image recognition, and computer vision. In addition, the chip model EP3SE50F484C4LN can be used in intelligent networks and scenarios, such as intelligent home and industrial automation. With its powerful processing capabilities, the EP3SE50F484C4LN is capable of handling complex tasks, making it ideal for the era of fully intelligent systems.
The EP3SE50F484C4LN is a powerful and reliable chip model that can be used in a variety of applications. Its scalability and flexibility make it ideal for use in advanced communication systems, intelligent networks, and intelligent scenarios. It is also well suited for the era of fully intelligent systems, providing powerful processing capabilities for complex tasks.
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1,530 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $886.2930 | $886.2930 |
| 10+ | $876.7629 | $8,767.6294 |
| 100+ | $829.1128 | $82,911.2784 |
| 1000+ | $781.4626 | $390,731.3120 |
| 10000+ | $714.7524 | $714,752.4000 |
| The price is for reference only, please refer to the actual quotation! | ||