EP3SE50F484C4L
EP3SE50F484C4L
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

EP3SE50F484C4L


EP3SE50F484C4L
F18-EP3SE50F484C4L
Active
FIELD PROGRAMMABLE GATE ARRAY, FBGA-484
FBGA-484

EP3SE50F484C4L ECAD Model


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EP3SE50F484C4L Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 900 mV
Number of Inputs 296
Number of Outputs 296
Number of Logic Cells 47500
Number of CLBs 1900
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Organization 1900 CLBS
Additional Feature IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Power Supplies 1.2/3.3 V
Supply Voltage-Max 940 mV
Supply Voltage-Min 860 mV
JESD-30 Code S-PBGA-B484
Qualification Status Not Qualified
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 484
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA484,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 23 mm
Length 23 mm
Seated Height-Max 3.2 mm
Ihs Manufacturer INTEL CORP
Package Description FBGA-484
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP3SE50F484C4L Datasheet Download


EP3SE50F484C4L Overview



The EP3SE50F484C4L chip model is a high-performance, low-power, low-cost programmable logic device (PLD) with a wide range of applications in digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL (Hardware Description Language) language, making it a powerful tool for the development of complex systems.


The EP3SE50F484C4L chip model has a wide range of features that make it suitable for a variety of applications. It has an integrated memory controller, which allows for the efficient storage and retrieval of data. It also has a high-speed logic array block (LAB) for fast logic operations, and a wide variety of I/O options for connecting to external devices. Additionally, the device has several built-in safety features to protect against accidental damage.


In order to use the EP3SE50F484C4L chip model effectively, it is important to have a good understanding of the product description and design requirements. In addition, it is important to consider actual case studies and any potential pitfalls that may arise from using the device. For example, when using the device for image processing, it is important to consider the effect of the device’s limited memory on the size of the images that can be processed.


The EP3SE50F484C4L chip model can be applied to the development and popularization of future intelligent robots. Its powerful features and low cost make it an ideal choice for the development of complex robotic systems. To use the model effectively, it is important to have a good understanding of the HDL language, as well as a good understanding of the product description and design requirements. In addition, it is important to have a good understanding of the device’s safety features and any potential pitfalls that may arise from using the device.



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Unit Price: $966.0012
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Pricing (USD)

QTY Unit Price Ext Price
1+ $898.3811 $898.3811
10+ $888.7211 $8,887.2110
100+ $840.4210 $84,042.1044
1000+ $792.1210 $396,060.4920
10000+ $724.5009 $724,500.9000
The price is for reference only, please refer to the actual quotation!

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