
Intel Corporation
EP3SE50F484C4L
EP3SE50F484C4L ECAD Model
EP3SE50F484C4L Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 296 | |
Number of Outputs | 296 | |
Number of Logic Cells | 47500 | |
Number of CLBs | 1900 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Organization | 1900 CLBS | |
Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
Power Supplies | 1.2/3.3 V | |
Supply Voltage-Max | 940 mV | |
Supply Voltage-Min | 860 mV | |
JESD-30 Code | S-PBGA-B484 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 484 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA484,22X22,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 23 mm | |
Length | 23 mm | |
Seated Height-Max | 3.2 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | FBGA-484 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EP3SE50F484C4L Datasheet Download
EP3SE50F484C4L Overview
The EP3SE50F484C4L chip model is a high-performance, low-power, low-cost programmable logic device (PLD) with a wide range of applications in digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL (Hardware Description Language) language, making it a powerful tool for the development of complex systems.
The EP3SE50F484C4L chip model has a wide range of features that make it suitable for a variety of applications. It has an integrated memory controller, which allows for the efficient storage and retrieval of data. It also has a high-speed logic array block (LAB) for fast logic operations, and a wide variety of I/O options for connecting to external devices. Additionally, the device has several built-in safety features to protect against accidental damage.
In order to use the EP3SE50F484C4L chip model effectively, it is important to have a good understanding of the product description and design requirements. In addition, it is important to consider actual case studies and any potential pitfalls that may arise from using the device. For example, when using the device for image processing, it is important to consider the effect of the device’s limited memory on the size of the images that can be processed.
The EP3SE50F484C4L chip model can be applied to the development and popularization of future intelligent robots. Its powerful features and low cost make it an ideal choice for the development of complex robotic systems. To use the model effectively, it is important to have a good understanding of the HDL language, as well as a good understanding of the product description and design requirements. In addition, it is important to have a good understanding of the device’s safety features and any potential pitfalls that may arise from using the device.
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1,844 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $898.3811 | $898.3811 |
10+ | $888.7211 | $8,887.2110 |
100+ | $840.4210 | $84,042.1044 |
1000+ | $792.1210 | $396,060.4920 |
10000+ | $724.5009 | $724,500.9000 |
The price is for reference only, please refer to the actual quotation! |