Intel Corporation
EP3SE260H780I4LG
EP3SE260H780I4LG ECAD Model
EP3SE260H780I4LG Attributes
| Type | Description | Select |
|---|---|---|
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Logic Cells | 255000 | |
| Number of CLBs | 10200 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Organization | 10200 CLBS | |
| Additional Feature | ALSO OPERATES AT 1.1V VCC NOMINAL | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 33 mm | |
| Length | 33 mm | |
| Seated Height-Max | 3.2 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | HBGA-780 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SE260H780I4LG Datasheet Download
EP3SE260H780I4LG Overview
The chip model EP3SE260H780I4LG is a highly advanced piece of technology with a range of benefits and potential applications in the future. Developed by Altera, this model is an FPGA (Field Programmable Gate Array) chip that offers a wide range of features and capabilities that make it an ideal choice for many industries.
The EP3SE260H780I4LG is a highly versatile chip that can be used in a variety of applications. It offers a range of features such as high-speed performance, low power consumption, cost-effectiveness, and flexibility. This makes it an ideal choice for many industries such as automotive, networking, telecommunications, industrial automation, and medical.
The EP3SE260H780I4LG is expected to be in high demand in the future, as more and more industries are looking for ways to reduce costs and improve efficiency. This chip model can help companies achieve this by providing them with the flexibility to customize their systems and reduce the need for costly hardware upgrades.
In terms of future applications, the EP3SE260H780I4LG is expected to be used in networks and intelligent scenarios. It can be used to develop and popularize future intelligent robots, as it offers features such as high-speed performance, low power consumption, and flexibility. This chip model is also expected to be used in the era of fully intelligent systems, as it can be used to develop and deploy complex intelligent systems.
To use the EP3SE260H780I4LG effectively, certain technical talents are needed. The chip model requires expertise in programming, hardware design, and software development. Additionally, knowledge of FPGA technology is also required, as this chip model is an FPGA chip.
In conclusion, the EP3SE260H780I4LG is a highly advanced chip model that offers a range of benefits and potential applications in the future. It is expected to be in high demand in the future, as more and more industries are looking for ways to reduce costs and improve efficiency. The chip model can be used in networks and intelligent scenarios, and it can be used to develop and popularize future intelligent robots. To use the EP3SE260H780I4LG effectively, certain technical talents are needed, such as expertise in programming, hardware design, and software development.
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5,675 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $20,250.3706 | $20,250.3706 |
| 10+ | $20,032.6246 | $200,326.2464 |
| 100+ | $18,943.8950 | $1,894,389.5040 |
| 1000+ | $17,855.1654 | $8,927,582.7200 |
| 10000+ | $16,330.9440 | $16,330,944.0000 |
| The price is for reference only, please refer to the actual quotation! | ||