Intel Corporation
EP3SE260H780I3G
EP3SE260H780I3G ECAD Model
EP3SE260H780I3G Attributes
| Type | Description | Select |
|---|---|---|
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 488 | |
| Number of Outputs | 488 | |
| Number of Logic Cells | 255000 | |
| Number of CLBs | 10200 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Organization | 10200 CLBS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 33 mm | |
| Length | 33 mm | |
| Seated Height-Max | 3.05 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | HBGA-780 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SE260H780I3G Datasheet Download
EP3SE260H780I3G Overview
The chip model EP3SE260H780I3G is a cutting-edge technology developed by Altera Corporation. It is a field-programmable gate array (FPGA) designed for high-performance applications in the fields of aerospace, telecom, and industrial control. It is the most advanced FPGA available on the market, providing a perfect balance between performance and cost.
The EP3SE260H780I3G chip offers a wide range of advantages, such as low power consumption, high performance, low latency, and high scalability. It has a high degree of flexibility, allowing it to be used in a variety of applications. It also features advanced error-correction and security features, making it an ideal choice for mission-critical applications.
The EP3SE260H780I3G chip is designed to meet the needs of modern communication systems. It supports a wide range of communication protocols, including Ethernet, Wi-Fi, Bluetooth, and ZigBee. It is also compatible with a variety of operating systems, such as Windows, Linux, and Android. Its advanced features make it suitable for the most demanding applications, such as machine-to-machine communication, remote control, and data transmission.
The EP3SE260H780I3G chip is expected to experience an increase in demand in the near future, due to its superior performance and cost-effectiveness. It is already being used in a variety of applications, such as military, automotive, and industrial automation. As the technology continues to improve, the chip is expected to become even more popular.
The original design intention of the EP3SE260H780I3G chip was to provide a powerful and cost-effective solution for high-performance applications. It is designed to be highly flexible, allowing it to be used in a variety of applications. The chip is also designed to be easily upgradable, allowing it to be used in advanced communication systems.
The product description and design requirements of the EP3SE260H780I3G chip are outlined in detail in the user manual. The manual describes the features of the chip, as well as the necessary precautions to ensure its proper functioning. Additionally, the manual includes several case studies, which demonstrate the chip’s capabilities in various applications.
In conclusion, the EP3SE260H780I3G chip is an advanced FPGA designed for high-performance applications. It offers a wide range of advantages, including low power consumption, high performance, low latency, and high scalability. It is expected to experience an increase in demand in the near future, due to its superior performance and cost-effectiveness. The chip is also designed to be easily upgradable, allowing it to be used in advanced communication systems. The product description and design requirements of the chip are outlined in detail in the user manual, along with several case studies.
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3,473 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $66,997.9920 | $66,997.9920 |
| 10+ | $66,277.5835 | $662,775.8347 |
| 100+ | $62,675.5409 | $6,267,554.0892 |
| 1000+ | $59,073.4983 | $29,536,749.1560 |
| 10000+ | $54,030.6387 | $54,030,638.7000 |
| The price is for reference only, please refer to the actual quotation! | ||