EP3SE260H780C4LG
EP3SE260H780C4LG
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rohs

Intel Corporation

EP3SE260H780C4LG


EP3SE260H780C4LG
F18-EP3SE260H780C4LG
Active
FIELD PROGRAMMABLE GATE ARRAY, HBGA-780
HBGA-780

EP3SE260H780C4LG ECAD Model


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EP3SE260H780C4LG Attributes


Type Description Select
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Logic Cells 255000
Number of CLBs 10200
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Organization 10200 CLBS
Additional Feature ALSO OPERATES AT 1.1V VCC NOMINAL
Supply Voltage-Max 940 mV
Supply Voltage-Min 860 mV
JESD-30 Code S-PBGA-B780
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 780
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA780,28X28,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 33 mm
Length 33 mm
Seated Height-Max 3.2 mm
Ihs Manufacturer INTEL CORP
Package Description HBGA-780
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP3SE260H780C4LG Datasheet Download


EP3SE260H780C4LG Overview



The chip model EP3SE260H780C4LG is a powerful and versatile model that has become increasingly popular in the electronics industry. It is a field-programmable gate array (FPGA) that is used to build and implement digital circuits. This chip model is designed to be used in a wide variety of applications, from industrial to consumer products, and is known for its high performance and reliability.


The EP3SE260H780C4LG model is an advanced FPGA that is capable of supporting a wide range of technologies. It is designed to be used in a variety of applications, such as embedded systems, automotive, consumer electronics, medical, and aerospace. It is also capable of supporting the latest technologies, including high-speed transceivers, high-speed transceivers for digital signal processing, and high-speed transceivers for high-speed data transmission.


The EP3SE260H780C4LG model is also designed to be used in the development and popularization of future intelligent robots. It is capable of supporting a wide range of technologies, from artificial intelligence to robotics, and can be used to create sophisticated robotic systems. It is also capable of supporting the latest technologies, such as high-speed transceivers for digital signal processing, and high-speed transceivers for high-speed data transmission.


In order to use the EP3SE260H780C4LG model effectively, it is important to understand the industry trends and the future development of related industries. It is also important to understand the product description and specific design requirements of the chip model, as well as actual case studies and precautions. Additionally, it is important to have the right technical talents to use the chip model effectively.


The EP3SE260H780C4LG model is a powerful and versatile model that is capable of supporting a wide range of technologies. It is designed to be used in a variety of applications, from industrial to consumer products, and is known for its high performance and reliability. In order to use the EP3SE260H780C4LG model effectively, it is important to understand the industry trends and the future development of related industries, as well as the product description and specific design requirements of the chip model, as well as actual case studies and precautions. Additionally, it is important to have the right technical talents to use the chip model effectively in order to develop and popularize future intelligent robots.



2,247 In Stock


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Unit Price: $63,936.9572
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $59,461.3702 $59,461.3702
10+ $58,822.0006 $588,220.0062
100+ $55,625.1528 $5,562,515.2764
1000+ $52,428.3049 $26,214,152.4520
10000+ $47,952.7179 $47,952,717.9000
The price is for reference only, please refer to the actual quotation!

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