EP3SE260H780C2
EP3SE260H780C2
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rohs

Intel Corporation

EP3SE260H780C2


EP3SE260H780C2
F18-EP3SE260H780C2
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, HBGA-780
HBGA-780

EP3SE260H780C2 ECAD Model


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EP3SE260H780C2 Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 900 mV
Number of Inputs 488
Number of Outputs 488
Number of Logic Cells 255000
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Additional Feature IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Clock Frequency-Max 800 MHz
Power Supplies 1.2/3.3 V
Supply Voltage-Max 940 mV
Supply Voltage-Min 860 mV
JESD-30 Code S-PBGA-B780
Qualification Status Not Qualified
Operating Temperature-Max 85 °C
Number of Terminals 780
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA780,28X28,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 33 mm
Length 33 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer INTEL CORP
Package Description HBGA-780
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP3SE260H780C2 Datasheet Download


EP3SE260H780C2 Overview



The chip model EP3SE260H780C2 is a high-performance FPGA chip developed by Altera Corporation. It is designed to provide high-speed, low-power, and high-density features, making it suitable for a wide range of applications. Its features include a high-speed transceiver, high-density logic, and low-power consumption. This chip model is suitable for use in embedded systems, data centers, and network applications.


The EP3SE260H780C2 chip model has great potential for use in the industry, especially in the areas of network security and data storage. Its high-speed transceiver makes it ideal for use in high-speed networks, while its high-density logic makes it suitable for data storage. Additionally, its low-power consumption makes it suitable for use in embedded systems and data centers.


The EP3SE260H780C2 chip model has the potential to be used in a variety of intelligent scenarios. Its high-speed transceiver and high-density logic make it suitable for use in intelligent systems, such as autonomous vehicles and robots. Additionally, its low-power consumption makes it suitable for use in smart home devices, such as smart thermostats and security systems.


The EP3SE260H780C2 chip model is expected to be in high demand in the future, as the demand for intelligent systems continues to grow. Its features make it suitable for use in a variety of scenarios, from autonomous vehicles to smart home devices. Additionally, its low-power consumption makes it suitable for use in data centers and embedded systems.


In the era of fully intelligent systems, the EP3SE260H780C2 chip model is expected to be in high demand. Its features make it suitable for use in a variety of intelligent scenarios, from autonomous vehicles to smart home devices. Additionally, its low-power consumption makes it suitable for use in data centers and embedded systems. As such, it is expected to be in high demand in the future.


In conclusion, the EP3SE260H780C2 chip model is a high-performance FPGA chip developed by Altera Corporation. It is designed to provide high-speed, low-power, and high-density features, making it suitable for a wide range of applications. Its features make it suitable for use in a variety of intelligent scenarios, from autonomous vehicles to smart home devices. Additionally, its low-power consumption makes it suitable for use in data centers and embedded systems. The EP3SE260H780C2 chip model is expected to be in high demand in the future, as the demand for intelligent systems continues to grow.



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Unit Price: $13,306.78
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Pricing (USD)

QTY Unit Price Ext Price
1+ $12,375.3054 $12,375.3054
10+ $12,242.2376 $122,422.3760
100+ $11,576.8986 $1,157,689.8600
1000+ $10,911.5596 $5,455,779.8000
10000+ $9,980.0850 $9,980,085.0000
The price is for reference only, please refer to the actual quotation!

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