Intel Corporation
EP3SE260F1517I4LG
EP3SE260F1517I4LG ECAD Model
EP3SE260F1517I4LG Attributes
| Type | Description | Select |
|---|---|---|
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Logic Cells | 255000 | |
| Number of CLBs | 10200 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Organization | 10200 CLBS | |
| Additional Feature | ALSO OPERATES AT 1.1V VCC NOMINAL | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B1517 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.7 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1517 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SE260F1517I4LG Datasheet Download
EP3SE260F1517I4LG Overview
The chip model EP3SE260F1517I4LG is a powerful, versatile and reliable semiconductor device that is designed to meet the needs of a wide range of applications. It is designed for high-performance and low-power operation, making it an ideal choice for a variety of industry applications.
The EP3SE260F1517I4LG chip model is designed to be used in a wide range of applications such as networking, embedded systems, and communications. It features a high-performance and low-power design, making it suitable for a variety of applications. The chip model is also designed to be used in a variety of intelligent scenarios, making it ideal for the era of fully intelligent systems.
The EP3SE260F1517I4LG chip model has a number of advantages over other chip models. It has a low power consumption, allowing it to be used in a variety of applications without compromising performance. It also has a high-speed operation and a high level of integration, making it suitable for use in a range of network and embedded systems. The chip model also offers a high level of reliability, making it an ideal choice for a variety of industry applications.
The EP3SE260F1517I4LG chip model is designed to meet the needs of a wide range of applications, making it a popular choice for many industries. It is expected that the demand for this chip model will continue to grow in the future, as more and more applications are developed.
In terms of its possible application in networks, the EP3SE260F1517I4LG chip model is designed to be used in a wide range of intelligent scenarios such as machine learning, artificial intelligence, robotics, and autonomous systems. The chip model is also designed to be used in a variety of embedded systems and communication networks, making it suitable for a variety of applications.
In terms of its design requirements, the EP3SE260F1517I4LG chip model is designed to meet a number of specific design requirements. These include a low power consumption, a high-speed operation, a high level of integration, and a high level of reliability. These design requirements make the chip model suitable for a variety of applications.
There are a number of case studies and precautions that should be taken when using the EP3SE260F1517I4LG chip model. For example, the chip model should be used with caution in applications where it is exposed to high temperatures or humidity, as this could cause the chip to malfunction. It is also important to ensure that the chip model is properly maintained and protected from any physical damage.
In conclusion, the EP3SE260F1517I4LG chip model is a reliable, versatile and powerful semiconductor device that is designed to meet the needs of a wide range of applications. It is designed for high-performance and low-power operation, making it an ideal choice for a variety of industry applications. It is expected that the demand for this chip model will continue to grow in the future, as more and more applications are developed. The chip model is also designed to be used in a variety of intelligent scenarios, making it ideal for the era of fully intelligent systems.
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4,585 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $77,601.1531 | $77,601.1531 |
| 10+ | $76,766.7321 | $767,667.3209 |
| 100+ | $72,594.6271 | $7,259,462.7087 |
| 1000+ | $68,422.5221 | $34,211,261.0410 |
| 10000+ | $62,581.5751 | $62,581,575.0750 |
| The price is for reference only, please refer to the actual quotation! | ||